IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1108-G-T

APH-1108-G-T

APH-1108-G-T

Samtec Inc.

4,026
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1114-T-R

APH-1114-T-R

APH-1114-T-R

Samtec Inc.

3,648
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0214-T-R

APH-0214-T-R

APH-0214-T-R

Samtec Inc.

1,162
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1208-G-T

APH-1208-G-T

APH-1208-G-T

Samtec Inc.

1,865
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0714-T-R

APH-0714-T-R

APH-0714-T-R

Samtec Inc.

4,842
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0308-G-T

APH-0308-G-T

APH-0308-G-T

Samtec Inc.

1,615
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1614-T-R

APH-1614-T-R

APH-1614-T-R

Samtec Inc.

4,551
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0908-G-T

APH-0908-G-T

APH-0908-G-T

Samtec Inc.

4,910
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1214-T-R

APH-1214-T-R

APH-1214-T-R

Samtec Inc.

1,895
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0814-T-R

APH-0814-T-R

APH-0814-T-R

Samtec Inc.

1,748
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0708-G-T

APH-0708-G-T

APH-0708-G-T

Samtec Inc.

2,056
RFQ

-

* - Active - - - - - - - - - - - - - - -
16-810-90

16-810-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,038
RFQ
16-810-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
13-7450-10

13-7450-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

1,019
RFQ
13-7450-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
13-7970-10

13-7970-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

3,983
RFQ
13-7970-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
38-3513-11

38-3513-11

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,860
RFQ
38-3513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-0503-21

15-0503-21

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2,349
RFQ
15-0503-21

Datasheet

0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
15-0503-31

15-0503-31

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,168
RFQ
15-0503-31

Datasheet

0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
22-0508-20

22-0508-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,791
RFQ
22-0508-20

Datasheet

508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
22-0508-30

22-0508-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

4,454
RFQ
22-0508-30

Datasheet

508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
22-1508-30

22-1508-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,898
RFQ
22-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
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