IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
XR2A-6411-N

XR2A-6411-N

I.C. CONNECTOR SOCKET

Omron Electronics Inc-EMC Div

3,047
RFQ

-

* Bulk Active - - - - - - - - - - - - - - -
14-8240-310C

14-8240-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,738
RFQ
14-8240-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-13-964-41-001000

110-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2,550
RFQ
110-13-964-41-001000

Datasheet

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-87-636-10-002101

299-87-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,536
RFQ
299-87-636-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-176-15-061101

510-83-176-15-061101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

4,028
RFQ
510-83-176-15-061101

Datasheet

510 Bulk Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-176-16-001101

510-83-176-16-001101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

3,534
RFQ
510-83-176-16-001101

Datasheet

510 Bulk Active PGA 176 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-176-16-071101

510-83-176-16-071101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

4,586
RFQ
510-83-176-16-071101

Datasheet

510 Bulk Active PGA 176 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-640-ATT

ICO-640-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,328
RFQ
ICO-640-ATT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
APH-1414-T-H

APH-1414-T-H

APH-1414-T-H

Samtec Inc.

1,882
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0514-T-H

APH-0514-T-H

APH-0514-T-H

Samtec Inc.

2,427
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1914-T-H

APH-1914-T-H

APH-1914-T-H

Samtec Inc.

1,490
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1114-T-H

APH-1114-T-H

APH-1114-T-H

Samtec Inc.

3,171
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0214-T-H

APH-0214-T-H

APH-0214-T-H

Samtec Inc.

2,383
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0814-T-H

APH-0814-T-H

APH-0814-T-H

Samtec Inc.

1,404
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1714-T-H

APH-1714-T-H

APH-1714-T-H

Samtec Inc.

2,870
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1214-T-H

APH-1214-T-H

APH-1214-T-H

Samtec Inc.

1,141
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1314-T-H

APH-1314-T-H

APH-1314-T-H

Samtec Inc.

4,093
RFQ

-

* - Active - - - - - - - - - - - - - - -
05-0511-11

05-0511-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics

4,044
RFQ
05-0511-11

Datasheet

511 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
3-1571586-5

3-1571586-5

CONN IC DIP SOCKET 64POS GOLD

TE Connectivity AMP Connectors

2,943
RFQ
3-1571586-5

Datasheet

800 Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
36-6513-10H

36-6513-10H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

1,583
RFQ
36-6513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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