IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-3503-20

24-3503-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,471
RFQ
24-3503-20

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-1508-21

14-1508-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,898
RFQ
14-1508-21

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
14-1508-31

14-1508-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,076
RFQ
14-1508-31

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
116-83-650-41-011101

116-83-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3,688
RFQ
116-83-650-41-011101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
11-0501-20

11-0501-20

CONN SOCKET SIP 11POS TIN

Aries Electronics

2,213
RFQ
11-0501-20

Datasheet

501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
11-0501-30

11-0501-30

CONN SOCKET SIP 11POS TIN

Aries Electronics

3,002
RFQ
11-0501-30

Datasheet

501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-4518-01

22-4518-01

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,370
RFQ
22-4518-01

Datasheet

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0309-T-10

HLS-0309-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,844
RFQ
HLS-0309-T-10

Datasheet

HLS Tube Active SIP 27 (3 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICA-316-ZWGG

ICA-316-ZWGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,109
RFQ
ICA-316-ZWGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0404-G-2

HLS-0404-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,017
RFQ
HLS-0404-G-2

Datasheet

HLS Bulk Active SIP 16 (4 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0408-T-2

HLS-0408-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,755
RFQ
HLS-0408-T-2

Datasheet

HLS Bulk Active SIP 32 (4 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
10-6621-30

10-6621-30

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3,727
RFQ
10-6621-30

Datasheet

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-3518-11H

24-3518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,372
RFQ
24-3518-11H

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-6501-30

28-6501-30

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

3,676
RFQ
28-6501-30

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
ICA-320-AGG

ICA-320-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,266
RFQ
ICA-320-AGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-320-AGG

ICO-320-AGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,301
RFQ
ICO-320-AGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-179-18-001101

510-83-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

4,707
RFQ
510-83-179-18-001101

Datasheet

510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-179-18-111101

510-83-179-18-111101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

4,635
RFQ
510-83-179-18-111101

Datasheet

510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-179-18-112101

510-83-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

4,054
RFQ
510-83-179-18-112101

Datasheet

510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-179-18-113101

510-83-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

1,367
RFQ
510-83-179-18-113101

Datasheet

510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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