IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
121-11-304-41-001000

121-11-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,504
RFQ
121-11-304-41-001000

Datasheet

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-122-31-018000

714-43-122-31-018000

CONN SOCKET SIP 22POS GOLD

Mill-Max Manufacturing Corp.

4,683
RFQ
714-43-122-31-018000

Datasheet

714 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-324-T-A

APO-324-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,904
RFQ
APO-324-T-A

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-320-G-J

APA-320-G-J

ADAPTER PLUG

Samtec Inc.

1,471
RFQ
APA-320-G-J

Datasheet

APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
12-7350-10

12-7350-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

3,644
RFQ
12-7350-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7435-10

12-7435-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

4,808
RFQ
12-7435-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7500-10

12-7500-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

4,108
RFQ
12-7500-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7550-10

12-7550-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

1,118
RFQ
12-7550-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7590-10

12-7590-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

4,267
RFQ
12-7590-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7750-10

12-7750-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

4,978
RFQ
12-7750-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-1508-20

22-1508-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,092
RFQ
22-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
APA-324-T-C

APA-324-T-C

ADAPTER PLUG

Samtec Inc.

3,528
RFQ
APA-324-T-C

Datasheet

APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-624-T-C

APA-624-T-C

ADAPTER PLUG

Samtec Inc.

3,361
RFQ
APA-624-T-C

Datasheet

APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-324-T-C

APO-324-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,222
RFQ
APO-324-T-C

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
28-0518-11H

28-0518-11H

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3,030
RFQ
28-0518-11H

Datasheet

518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-1518-11H

28-1518-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,484
RFQ
28-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-628-41-013101

116-83-628-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,332
RFQ
116-83-628-41-013101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-316-ZHGT

ICA-316-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,207
RFQ
ICA-316-ZHGT

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-640-WTT-3

ICA-640-WTT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,039
RFQ
ICA-640-WTT-3

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
40-9513-10T

40-9513-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,573
RFQ
40-9513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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