IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
614-43-304-31-018000

614-43-304-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,722
RFQ
614-43-304-31-018000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-83-624-10-002101

299-83-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,449
RFQ
299-83-624-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-632-WTT

ICA-632-WTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,079
RFQ
ICA-632-WTT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
HLS-0208-G-22

HLS-0208-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,051
RFQ
HLS-0208-G-22

Datasheet

HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-87-240-17-061101

510-87-240-17-061101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

4,018
RFQ
510-87-240-17-061101

Datasheet

510 Bulk Active PGA 240 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-632-ATT

ICO-632-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,937
RFQ
ICO-632-ATT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
540-44-068-17-400004

540-44-068-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

4,630
RFQ
540-44-068-17-400004

Datasheet

540 Tape & Reel (TR) Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
ICO-624-ZAGT

ICO-624-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,339
RFQ
ICO-624-ZAGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-624-ZAGT

ICA-624-ZAGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,805
RFQ
ICA-624-ZAGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-324-WGT

ICA-324-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,011
RFQ
ICA-324-WGT

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-324-ZAGT

ICO-324-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,638
RFQ
ICO-324-ZAGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-624-WGT

ICA-624-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,157
RFQ
ICA-624-WGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APO-318-T-B

APO-318-T-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,872
RFQ
APO-318-T-B

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
30-6501-20

30-6501-20

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

1,888
RFQ
30-6501-20

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-6501-30

30-6501-30

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

4,826
RFQ
30-6501-30

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
01-0518-00

01-0518-00

CONN SOCKET SIP 1POS GOLD

Aries Electronics

1,467
RFQ
01-0518-00

Datasheet

518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-0518-11H

36-0518-11H

CONN SOCKET SIP 36POS GOLD

Aries Electronics

3,857
RFQ
36-0518-11H

Datasheet

518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-1518-11H

36-1518-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

1,885
RFQ
36-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-C195-00

16-C195-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,853
RFQ
16-C195-00

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-C280-00

16-C280-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,613
RFQ
16-C280-00

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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