IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-83-328-41-011101

116-83-328-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,133
RFQ
116-83-328-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
30-1518-11

30-1518-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,098
RFQ
30-1518-11

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
44-1518-10

44-1518-10

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

4,090
RFQ
44-1518-10

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
PLCC-084-T-N-TR

PLCC-084-T-N-TR

CONN SOCKET PLCC 84POS TIN

Samtec Inc.

2,159
RFQ
PLCC-084-T-N-TR

Datasheet

PLCC Tape & Reel (TR) Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
HLS-2007-G-12

HLS-2007-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,524
RFQ
HLS-2007-G-12

Datasheet

HLS Bulk Active SIP 140 (20 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
23-0513-11

23-0513-11

CONN SOCKET SIP 23POS GOLD

Aries Electronics

4,142
RFQ
23-0513-11

Datasheet

0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-4518-10M

22-4518-10M

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,139
RFQ
22-4518-10M

Datasheet

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
612-83-648-41-001101

612-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,272
RFQ
612-83-648-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0120-TT-12

HLS-0120-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,940
RFQ
HLS-0120-TT-12

Datasheet

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
116-87-640-41-002101

116-87-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

4,886
RFQ
116-87-640-41-002101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-308-ZMGG

ICO-308-ZMGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,610
RFQ
ICO-308-ZMGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-87-652-41-012101

116-87-652-41-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,393
RFQ
116-87-652-41-012101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-624-SST-L

ICA-624-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,134
RFQ
ICA-624-SST-L

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-324-SST-L

ICA-324-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,493
RFQ
ICA-324-SST-L

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-324-SST-L

ICO-324-SST-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,063
RFQ
ICO-324-SST-L

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
14-0517-90C

14-0517-90C

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2,836
RFQ
14-0517-90C

Datasheet

0517 Bulk Active SIP 14 (1 x 14) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-145-13-041101

510-87-145-13-041101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

2,992
RFQ
510-87-145-13-041101

Datasheet

510 Bulk Active PGA 145 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
12-3513-11H

12-3513-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

1,452
RFQ
12-3513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-0518-11

30-0518-11

CONN SOCKET SIP 30POS GOLD

Aries Electronics

1,287
RFQ
30-0518-11

Datasheet

518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
APO-318-T-A

APO-318-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,077
RFQ
APO-318-T-A

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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