IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
18-3518-101

18-3518-101

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,955
RFQ
18-3518-101

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0110-G-10

HLS-0110-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,908
RFQ
HLS-0110-G-10

Datasheet

HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
117-87-656-41-105101

117-87-656-41-105101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip

1,675
RFQ
117-87-656-41-105101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-83-614-10-002101

299-83-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,652
RFQ
299-83-614-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-316-ZLGT

ICO-316-ZLGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,234
RFQ
ICO-316-ZLGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
146-87-640-41-035101

146-87-640-41-035101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,213
RFQ
146-87-640-41-035101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-640-41-036101

146-87-640-41-036101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

1,365
RFQ
146-87-640-41-036101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0115-T-2

HLS-0115-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,187
RFQ
HLS-0115-T-2

Datasheet

HLS Tube Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
36-6513-10T

36-6513-10T

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,841
RFQ
36-6513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0107-G-12

HLS-0107-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,643
RFQ
HLS-0107-G-12

Datasheet

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
14-3511-11

14-3511-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,695
RFQ
14-3511-11

Datasheet

511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-3511-11WR

14-3511-11WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,545
RFQ
14-3511-11WR

Datasheet

511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
ICA-314-WGT-3

ICA-314-WGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,640
RFQ
ICA-314-WGT-3

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APO-314-G-J

APO-314-G-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,568
RFQ
APO-314-G-J

Datasheet

APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
116-87-636-41-009101

116-87-636-41-009101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,919
RFQ
116-87-636-41-009101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-308-ZNGG

ICO-308-ZNGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,891
RFQ
ICO-308-ZNGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-320-SGT-L

ICA-320-SGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,697
RFQ
ICA-320-SGT-L

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
614-83-650-41-001101

614-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,814
RFQ
614-83-650-41-001101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0120-S-2

HLS-0120-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,979
RFQ
HLS-0120-S-2

Datasheet

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
18-6511-10

18-6511-10

SOCKET 18 PIN SOLDER TAIL TIN

Aries Electronics

2,453
RFQ

-

511 - Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER