IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
ICF-320-TL-O-TR

ICF-320-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,630
RFQ
ICF-320-TL-O-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
HLS-0107-T-11

HLS-0107-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,935
RFQ
HLS-0107-T-11

Datasheet

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
AR 36-HZL/07-TT

AR 36-HZL/07-TT

SOCKET

Assmann WSW Components

2,784
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-87-432-41-018101

116-87-432-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,117
RFQ
116-87-432-41-018101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-324-41-001101

612-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,231
RFQ
612-83-324-41-001101

Datasheet

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0108-T-2

HLS-0108-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,807
RFQ
HLS-0108-T-2

Datasheet

HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
117-87-430-41-105101

117-87-430-41-105101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

1,340
RFQ
117-87-430-41-105101

Datasheet

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D2864-42

D2864-42

CONN IC DIP SOCKET 64POS GOLD

Harwin Inc.

1,280
RFQ
D2864-42

Datasheet

D2 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
HLS-0208-TT-22

HLS-0208-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,382
RFQ
HLS-0208-TT-22

Datasheet

HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
510-87-073-11-061101

510-87-073-11-061101

CONN SOCKET PGA 73POS GOLD

Preci-Dip

2,072
RFQ
510-87-073-11-061101

Datasheet

510 Bulk Active PGA 73 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-316-41-004101

116-87-316-41-004101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

1,211
RFQ
116-87-316-41-004101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
BU200Z-178-HT

BU200Z-178-HT

CONN IC DIP SOCKET 20POS GOLD

On Shore Technology Inc.

2,841
RFQ
BU200Z-178-HT

Datasheet

BU-178HT Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
146-87-424-41-036101

146-87-424-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,571
RFQ
146-87-424-41-036101

Datasheet

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-320-STL-O-TR

ICF-320-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,335
RFQ
ICF-320-STL-O-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-320-STL-I-TR

ICF-320-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,960
RFQ
ICF-320-STL-I-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
122-87-324-41-001101

122-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,796
RFQ
122-87-324-41-001101

Datasheet

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-624-41-035101

146-87-624-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,102
RFQ
146-87-624-41-035101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-624-41-036101

146-87-624-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,120
RFQ
146-87-624-41-036101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-044-08-031101

510-83-044-08-031101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

1,296
RFQ
510-83-044-08-031101

Datasheet

510 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-632-31-012101

614-87-632-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,118
RFQ
614-87-632-31-012101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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