IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1402-T-T

APH-1402-T-T

APH-1402-T-T

Samtec Inc.

2,359
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1202-T-T

APH-1202-T-T

APH-1202-T-T

Samtec Inc.

4,781
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0802-T-T

APH-0802-T-T

APH-0802-T-T

Samtec Inc.

3,829
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1702-T-T

APH-1702-T-T

APH-1702-T-T

Samtec Inc.

3,801
RFQ

-

* - Active - - - - - - - - - - - - - - -
08-3518-10E

08-3518-10E

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,518
RFQ
08-3518-10E

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-87-632-41-105191

110-87-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,187
RFQ

-

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
16-0513-11

16-0513-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

4,383
RFQ
16-0513-11

Datasheet

0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-0503-20

06-0503-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

4,354
RFQ
06-0503-20

Datasheet

0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
06-0503-30

06-0503-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,620
RFQ
06-0503-30

Datasheet

0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
18-3518-00

18-3518-00

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,040
RFQ
18-3518-00

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
15-0518-00

15-0518-00

CONN SOCKET SIP 15POS GOLD

Aries Electronics

4,339
RFQ
15-0518-00

Datasheet

518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
2-1814640-5

2-1814640-5

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

4,575
RFQ
2-1814640-5

Datasheet

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
212-1-18-003

212-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

4,861
RFQ
212-1-18-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
SIP050-1X32-160B

SIP050-1X32-160B

1X32-160B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

1,581
RFQ
SIP050-1X32-160B

Datasheet

SIP050-1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-83-420-41-012101

116-83-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,323
RFQ
116-83-420-41-012101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-318-41-008101

116-83-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,871
RFQ
116-83-318-41-008101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-318-41-035101

146-83-318-41-035101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

1,387
RFQ
146-83-318-41-035101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-318-41-036101

146-83-318-41-036101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,323
RFQ
146-83-318-41-036101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
346-43-107-41-013000

346-43-107-41-013000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.

2,453
RFQ
346-43-107-41-013000

Datasheet

346 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-308-T-M

APA-308-T-M

ADAPTER PLUG

Samtec Inc.

4,297
RFQ
APA-308-T-M

Datasheet

APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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