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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
540-99-044-24-000000CONN SOCKET PLCC 44POS TIN-LEAD |
3,680 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
1571539-1CONN SOCKET PLCC 20POS TIN |
2,502 |
|
Datasheet |
- | Bulk | Obsolete | PLCC | 20 (4 x 5) | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 125°C |
|
110-87-328-41-001101CONN IC DIP SOCKET 28POS GOLD |
4,468 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0204-TT-2.100" SCREW MACHINE SOCKET ARRAY |
1,836 |
|
Datasheet |
HLS | Tube | Active | SIP | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Thermoplastic | -55°C ~ 140°C |
|
|
09-0513-10CONN SOCKET SIP 9POS GOLD |
2,778 |
|
Datasheet |
0513 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
10-0513-10TCONN SOCKET SIP 10POS GOLD |
3,380 |
|
Datasheet |
0513 | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
05-0518-11HCONN SOCKET SIP 5POS GOLD |
3,565 |
|
Datasheet |
518 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
13-0518-10CONN SOCKET SIP 13POS GOLD |
2,689 |
|
Datasheet |
518 | Bulk | Active | SIP | 13 (1 x 13) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
03-0508-30CONN SOCKET SIP 3POS GOLD |
1,748 |
|
Datasheet |
508 | Bulk | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
|
|
SIP1X27-014BSIP1X27-014B-SIP SOCKET 27 CTS |
3,673 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 27 (1 x 27) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
116-87-610-41-007101CONN IC DIP SOCKET 10POS GOLD |
4,124 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
110-83-312-41-105101CONN IC DIP SOCKET 12POS GOLD |
4,600 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-324-41-605101CONN IC DIP SOCKET 24POS GOLD |
1,630 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-324-41-005101CONN IC DIP SOCKET 24POS GOLD |
1,348 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0102-G-12.100" SCREW MACHINE SOCKET ARRAY |
4,853 |
|
Datasheet |
HLS | Tube | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
|
ARO 64-HZL/NEC-TSOCKET |
3,222 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
540-99-032-24-000000CONN SOCKET PLCC 32POS TIN-LEAD |
4,551 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
AR24-HZL/7/07-TTCONN IC DIP SOCKET 24POS GOLD |
4,088 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
ED044PLCZCONN SOCKET PLCC 44POS TIN |
1,787 |
|
Datasheet |
ED | Tube | Active | PLCC | 44 (2 x 22) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
|
A-ICS-254-08-TT50IC SOCKET, MACHINED PIN, 7.62MM, |
3,674 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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