IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
11-0518-10T

11-0518-10T

CONN SOCKET SIP 11POS GOLD

Aries Electronics

4,285
RFQ
11-0518-10T

Datasheet

518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ED068PLCZ-SM-N

ED068PLCZ-SM-N

CONN SOCKET PLCC 68POS

On Shore Technology Inc.

2,651
RFQ
ED068PLCZ-SM-N

Datasheet

ED Tube Active PLCC 68 (2 x 34) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
A-CCS68-G

A-CCS68-G

CONN SOCKET PLCC 68POS GOLD

Assmann WSW Components

3,399
RFQ
A-CCS68-G

Datasheet

- Bag Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
1-1437535-9

1-1437535-9

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

4,044
RFQ
1-1437535-9

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass - -55°C ~ 105°C
A28-LCG-T-R

A28-LCG-T-R

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

1,021
RFQ
A28-LCG-T-R

Datasheet

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
506-AG12D-LF

506-AG12D-LF

CONN IC DIP SOCKET 6POS TIN

TE Connectivity AMP Connectors

3,976
RFQ
506-AG12D-LF

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
D01-9950742

D01-9950742

CONN SOCKET SIP 7POS GOLD

Harwin Inc.

3,818
RFQ
D01-9950742

Datasheet

D01-995 Tube Obsolete SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-003101

116-83-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,161
RFQ
116-83-310-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-420-41-003101

115-87-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,353
RFQ
115-87-420-41-003101

Datasheet

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X16-157B

SIP050-1X16-157B

1X16-157B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

4,283
RFQ
SIP050-1X16-157B

Datasheet

SIP050-1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
114-83-314-41-117101

114-83-314-41-117101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1,354
RFQ
114-83-314-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-314-41-134161

114-83-314-41-134161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

4,921
RFQ
114-83-314-41-134161

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-003101

116-87-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,543
RFQ
116-87-314-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-028-06-001101

510-87-028-06-001101

CONN SOCKET PGA 28POS GOLD

Preci-Dip

1,955
RFQ
510-87-028-06-001101

Datasheet

510 Bulk Active PGA 28 (6 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
210-1-24-006

210-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech

2,144
RFQ
210-1-24-006

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
822472-7

822472-7

CONN SOCKET PLCC 84POS TIN-LEAD

TE Connectivity AMP Connectors

3,857
RFQ
822472-7

Datasheet

- Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Thermoplastic -
115-87-422-41-001101

115-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,855
RFQ

-

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-210-41-012101

116-87-210-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,702
RFQ
116-87-210-41-012101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-308-41-008101

116-83-308-41-008101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

4,945
RFQ
116-83-308-41-008101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-308-41-036101

146-83-308-41-036101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,619
RFQ
146-83-308-41-036101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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