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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SIP050-1X12-160B1X12-160B-SIP SOCKET 12 CTS |
2,560 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
540-99-020-17-400000CONN SOCKET PLCC 20POS TIN-LEAD |
4,204 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
|
540-99-020-17-400200CONN SOCKET PLCC 20POS TIN-LEAD |
4,343 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
115-87-318-41-003101CONN IC DIP SOCKET 18POS GOLD |
4,100 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
0787250002CONN CAMERA SOCKET 18POS GOLD |
2,472 |
|
Datasheet |
78725 | Tray | Obsolete | Camera Socket | 18 (2 x 9) | - | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | - | Gold | Flash | Copper Alloy | Thermoplastic | -30°C ~ 85°C |
|
|
110-87-324-41-001151CONN IC DIP SOCKET 24POS GOLD |
3,059 |
|
- |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
DIP632-011BDIP632-011B-DIP SOCKET 32 CTS |
2,882 |
|
Datasheet |
- | Bag | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
A-CCS52-Z-RCONN SOCKET PLCC 52POS TIN |
4,235 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
116-83-308-41-012101CONN IC DIP SOCKET 8POS GOLD |
3,527 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
110-87-310-41-105191CONN IC DIP SOCKET 10POS GOLD |
3,931 |
|
- |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
06-3513-10CONN IC DIP SOCKET 6POS GOLD |
4,077 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
116-87-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
3,589 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-314-41-105161CONN IC DIP SOCKET 14POS GOLD |
4,715 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0102-G-11.100" SCREW MACHINE SOCKET ARRAY |
3,810 |
|
Datasheet |
HLS | Tube | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
|
HLS-0202-T-2.100" SCREW MACHINE SOCKET ARRAY |
3,906 |
|
Datasheet |
HLS | Tube | Active | SIP | 4 (2 x 2) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
|
02-0508-30CONN SOCKET SIP 2POS GOLD |
3,100 |
|
Datasheet |
508 | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
|
|
02-1508-30CONN IC DIP SOCKET 2POS GOLD |
2,783 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
|
917-83-104-41-053101CONN TRANSIST TO-5 4POS GOLD |
3,616 |
|
Datasheet |
917 | Bulk | Active | Transistor, TO-5 | 4 (Round) | - | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
06-2513-10CONN IC DIP SOCKET 6POS GOLD |
4,732 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
06-6513-10TCONN IC DIP SOCKET 6POS GOLD |
3,813 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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