IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-87-304-41-013101

116-87-304-41-013101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

4,898
RFQ
116-87-304-41-013101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR16-HZW/T

AR16-HZW/T

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

2,610
RFQ
AR16-HZW/T

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
110-83-312-01-680101

110-83-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

1,353
RFQ
110-83-312-01-680101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-312-41-117101

114-83-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

1,936
RFQ
114-83-312-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-312-41-134161

114-83-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

4,623
RFQ
114-83-312-41-134161

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP632-014B

DIP632-014B

DIP632-014B-DIP SOCKET 32 CTS

Amphenol ICC (FCI)

4,308
RFQ
DIP632-014B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
D01-9950642

D01-9950642

CONN SOCKET SIP 6POS GOLD

Harwin Inc.

2,673
RFQ
D01-9950642

Datasheet

D01-995 Tube Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-312-41-003101

116-87-312-41-003101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,438
RFQ
116-87-312-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-310-41-001101

614-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

4,174
RFQ
614-83-310-41-001101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0102-G-10

HLS-0102-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,557
RFQ
HLS-0102-G-10

Datasheet

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
07-0518-11

07-0518-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,263
RFQ
07-0518-11

Datasheet

518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
123-87-310-41-001101

123-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,646
RFQ
123-87-310-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
4-382568-0

4-382568-0

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

4,439
RFQ
4-382568-0

Datasheet

Diplomate DL Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
612-87-314-41-001101

612-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

4,257
RFQ
612-87-314-41-001101

Datasheet

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-306-41-004101

116-87-306-41-004101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,968
RFQ
116-87-306-41-004101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-610-41-001101

614-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,071
RFQ
614-83-610-41-001101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-20LCC-N-TR

SMPX-20LCC-N-TR

SMT PLCC 20P NON POLARISED, T&R

Kycon, Inc.

3,451
RFQ
SMPX-20LCC-N-TR

Datasheet

SMPX Tape & Reel (TR) Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
116-83-306-41-009101

116-83-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,043
RFQ
116-83-306-41-009101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-318-41-117101

114-87-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

1,864
RFQ
114-87-318-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D00-044-490-001

D00-044-490-001

CONN SOCKET PLCC 44POS TIN-LEAD

EDAC Inc.

1,189
RFQ
D00-044-490-001

Datasheet

D00 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) - Surface Mount Closed Frame - - - - - - -
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