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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
228-5204-01 CONN SOCKET QFN 28POS GOLD 3M	3,093	-	RFQ	Datasheet	Textool™	Bulk	Active	QFN	28 (4 x 7)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
115-93-308-41-003000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	3,735	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
940-44-020-17-400000 CONN SOCKET PLCC 20POS TIN Mill-Max Manufacturing Corp.	4,399	-	RFQ	Datasheet	940	Tube	Active	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-99-316-01-670800 CONN IC DIP SOCKET 16POS TINLEAD Mill-Max Manufacturing Corp.	2,490	-	RFQ	Datasheet	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
XR2A-1411-N CONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div	1,787	-	RFQ	Datasheet	XR2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
AR 16-HZW/TN CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	2,741	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
214-44-628-01-670800 CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp.	3,343	-	RFQ	Datasheet	214	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
D0816-42 CONN IC DIP SOCKET 16POS GOLD Harwin Inc.	2,490	-	RFQ	Datasheet	D0	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-43-632-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	1,892	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-93-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	3,495	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
XR2C-2005 CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div	3,952	-	RFQ	Datasheet	XR2	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
299-93-312-10-001000 CONN IC DIP SOCKET 12POS GOLD Mill-Max Manufacturing Corp.	2,444	-	RFQ	Datasheet	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
14-810-90C CONN IC DIP SOCKET 14POS GOLD Aries Electronics	1,802	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
A 24-LC-TR CONN IC DIP SOCKET 24POS TIN Assmann WSW Components	3,792	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
210-47-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	4,794	-	RFQ	Datasheet	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-1-40-006 CONN IC DIP SOCKET 40POS GOLD CNC Tech	4,737	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
116-87-610-41-008101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3,355	-	RFQ	Datasheet	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
111-47-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	3,984	-	RFQ	Datasheet	111	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	4,544	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 24-HZL/01-TT CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	1,562	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C

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