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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
299-93-318-11-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	3,221	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
117-93-652-41-005000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	3,792	-	RFQ	Datasheet	117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-624-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	1,364	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-614-10-002000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	2,026	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-616-10-002000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	1,467	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-43-628-41-801000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	1,534	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-43-324-10-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2,314	-	RFQ	Datasheet	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-324-10-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2,839	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-93-049-07-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,492	-	RFQ	Datasheet	510	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	49 (7 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-640-41-801000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	3,806	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-43-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	2,378	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
44-3572-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	1,161	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-3573-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	4,382	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
210-83-308-41-101000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	1,941	-	RFQ	-	210	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-308-41-530000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	3,970	-	RFQ	Datasheet	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-316-41-530000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	1,562	-	RFQ	-	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-318-41-530000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,093	-	RFQ	Datasheet	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-628-41-530000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	1,461	-	RFQ	-	110	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
CAP-002-01-00 0603 Capacitor Test Socket MiS Technologies	1,534	-	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
S582-11-898-15-001414 898 POS BGA SOCKET .050 Mill-Max Manufacturing Corp.	1,660	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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