info@Fullcores.com
My Inquiry
My Account
Upload BOM
IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-1571552-6820-AG11D-ESL-LF=800 DIP GF/SN |
2,010 |
|
Datasheet |
800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
820-AG11D-ESL-LFIC SOCKET, DIP20, 20 CONTACT(S), |
2,010 |
|
Datasheet |
800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
3-1571552-2840-AG11D-ESL-LF=800 DIP GF/SN |
5,833 |
|
Datasheet |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
840-AG11D-ESL-LFIC SOCKET, DIP40, 40 CONTACT(S), |
5,833 |
|
Datasheet |
800 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
110-87-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
416 |
|
Datasheet |
110 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
SA203000CONN IC DIP SOCKET 20POS GOLD |
645 |
|
Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
48-6554-11CONN IC DIP SOCKET ZIF 48POS GLD |
2,063 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
220-2600-00-0602CONN SOCKET SIP ZIF 20POS GOLD |
3,336 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
236-6225-00-0602CONN SOCKET SIP ZIF 36POS GOLD |
2,055 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 36 (1 x 36) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
248-5205-01CONN SOCKET QFN 48POS GOLD |
3,320 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 48 (4 x 12) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
264-5205-01CONN SOCKET QFN 64POS GOLD |
4,210 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 64 (4 x 16) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
441-PRS21001-12CONN SOCKET PGA ZIF GOLD |
1,447 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
|
288-4205-01CONN SOCKET QFN 88POS GOLD |
3,008 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 88 (4 x 22) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
ICS-624-TIC SOCKET, DIP, 24P 2.54MM PITCH |
791 |
|
Datasheet |
ICS | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
ED06DTCONN IC DIP SOCKET 6POS TIN |
470 |
|
Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C |
|
ICS-632-TIC SOCKET, DIP, 32P 2.54MM PITCH |
801 |
|
Datasheet |
ICS | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
ED32DTCONN IC DIP SOCKET 32POS TIN |
879 |
|
Datasheet |
ED | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C |
|
ICM-306-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 6P |
770 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
A 24-LC/7-TCONN IC DIP SOCKET 24POS TIN |
707 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
|
A 22-LC-T2CONN IC DIP SOCKET 22POS TIN |
687 |
|
Datasheet |
- | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
- 4,000+ Daily Average RFQ
- 12,000,000+ SKUs
- 2,900+ Worldwide Manufacturers
- 9,000+ ㎡ In-stock Warehouse
