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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-822114-3CONN SOCKET PQFP 144POS TIN-LEAD |
3,852 |
|
Datasheet |
- | Tube | Obsolete | QFP | 144 (4 x 36) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
2201838-2CONN SOCKET LGA 2011POS GOLD |
3,453 |
|
Datasheet |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | - |
|
|
2201838-1CONN SOCKET LGA 2011POS GOLD |
4,709 |
|
Datasheet |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
ASPI0002-P001ASPI 8Pin WSON 8X6 |
3,430 |
|
Datasheet |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
ASPI0001-P001ASPI 8 PIN_IC 150mil |
1,710 |
|
Datasheet |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
ACA-SPI-004-K01SPI 8 PIN_IC 208mil |
1,660 |
|
Datasheet |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
123-43-422-41-001000CONN IC DIP SOCKET 22POS GOLD |
165 |
|
Datasheet |
123 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-93-306-10-001000CONN IC DIP SOCKET 6POS GOLD |
543 |
|
Datasheet |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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|
123-43-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
300 |
|
Datasheet |
123 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
612-11-420-41-001000SKT CARRIER SOLDRTL |
223 |
|
Datasheet |
612 | Tube | Active | DIP, 0.1" (2.54mm) Row Spacing | - | 0.039" (1.00mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.039" (1.00mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
123-93-320-41-801000CONN IC DIP SOCKET 20POS GOLD |
104 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
210815-4CONN SOCKET PGA 223POS GOLD |
4,188 |
|
Datasheet |
- | Tube | Obsolete | PGA | 223 (18 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 196.9µin (5.00µm) | Phosphor Bronze | Thermoplastic, Polyester, Glass Filled | - |
|
2174988-2CONN SOCKET LGA 2011POS GOLD |
1,812 |
|
Datasheet |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | - |
|
|
2-822064-4CONN SOCKET PQFP 100POS TIN-LEAD |
3,497 |
|
Datasheet |
- | Tube | Obsolete | QFP | 100 (4 x 25) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
123-43-318-41-801000CONN IC DIP SOCKET 18POS GOLD |
239 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-43-318-11-001000CONN IC DIP SOCKET 18POS GOLD |
197 |
|
Datasheet |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-93-324-11-001000CONN IC DIP SOCKET 24POS GOLD |
157 |
|
Datasheet |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
299-43-614-10-002000CONN IC DIP SOCKET 14POS GOLD |
201 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
5-1437504-8TRANSISTOR SKT |
3,048 |
|
Datasheet |
8080 | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
299-93-622-10-002000CONN IC DIP SOCKET 22POS GOLD |
195 |
|
Datasheet |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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