info@Fullcores.com
My Inquiry
My Account
Upload BOM
IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
50960-0084N-0011.27MM PITCH SPI FLASH SOCKET CO |
689 |
|
- |
50960 | Cut Tape (CT) | Active | SIP | 8 | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Thermoplastic | - |
|
|
91960-0084N8P, 1.27MM PSI FLASH SOCKET, SMT |
677 |
|
Datasheet |
91960 | Cut Tape (CT) | Active | DIP, ZIF (ZIP) | 8 | 0.050" (1.27mm) | Tin | 50.0µin (1.27µm) | Copper Alloy | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | 50.0µin (1.27µm) | Copper Alloy | Thermoplastic | -40°C ~ 85°C |
|
AR 16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD |
1,391 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
1814640-8CONN IC DIP SOCKET 8POS TIN |
2,766 |
|
Datasheet |
- | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
|
5-1571552-6CONN IC DIP SOCKET 24POS GOLD |
3,028 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
824-AG11D-ESL-LFCONN IC DIP SOCKET 24POS GOLD |
1,845 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
520-AG11D-ESDIP SOCKET T/H 20POS |
3,139 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
50950-0084N-0021.27MM PITCH WINBOND SOCKET CONN |
775 |
|
Datasheet |
50950 | Cut Tape (CT) | Active | PLCC | 8 | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Copper Alloy | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Copper Alloy | Thermoplastic | - |
|
110-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
456 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
1-1825376-2CONN IC DIP SOCKET 28POS GOLD |
1,163 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
|
1-1571552-0CONN IC DIP SOCKET 32POS TIN |
3,398 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
4-1571552-6CONN IC DIP SOCKET 20POS GOLD |
4,501 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
]-1xx-41-013000.jpg)
|
346-93-109-41-013000CONN SOCKET SIP 9POS GOLD |
175 |
|
Datasheet |
346 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
APA-308-T-AADAPTER PLUG |
3,314 |
|
Datasheet |
APA | Bulk | Active | - | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
APO-308-T-A.100" LOW PROFILE SCREW MACHINE |
2,065 |
|
Datasheet |
APO | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
714-43-204-31-018000CONN IC DIP SOCKET 4POS GOLD |
1,545 |
|
Datasheet |
714 | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
2-1571551-6CONN IC DIP SOCKET 20POS GOLD |
3,384 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | Polyester | -55°C ~ 125°C |
|
824-AG31D-ESCONN IC DIP SOCKET 24POS TINLEAD |
1,727 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
516-AG10D-ESCONN IC DIP SOCKET 16POS GOLD |
1,483 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
|
828-AG11D-ESCONN IC DIP SOCKET 28POS GOLD |
1,235 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
- 4,000+ Daily Average RFQ
- 12,000,000+ SKUs
- 2,900+ Worldwide Manufacturers
- 9,000+ ㎡ In-stock Warehouse
