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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
4816-3000-CP CONN IC DIP SOCKET 16POS TIN 3M	11,180	-	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
4814-3004-CP CONN IC DIP SOCKET 14POS TIN 3M	9,841	-	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
4814-3000-CP CONN IC DIP SOCKET 14POS TIN 3M	8,797	-	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
SA103000 CONN IC DIP SOCKET 10POS GOLD On Shore Technology Inc.	3,976	-	RFQ	Datasheet	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
110-99-308-41-001000 CONN IC DIP SOCKET 8POS TIN-LEAD Mill-Max Manufacturing Corp.	2,011	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
1-2199298-8 CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors	1,238	-	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
ICM-314-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 14P Adam Tech	1,458	-	RFQ	Datasheet	ICM	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
DILB28P-223TLF CONN IC DIP SOCKET 28POS TIN Amphenol ICC (FCI)	2,755	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
4816-3004-CP CONN IC DIP SOCKET 16POS TIN 3M	11,641	-	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
110-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	1,261	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
4820-3000-CP CONN IC DIP SOCKET 20POS TIN 3M	4,510	-	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
1-2199299-2 28P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors	3,376	-	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-9 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	2,752	-	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
08-3518-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2,190	-	RFQ	Datasheet	518	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
ICM-316-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 16P Adam Tech	2,836	-	RFQ	Datasheet	ICM	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
245-40-1-06 CONN IC DIP SOCKET 40POS TIN CNC Tech	2,230	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole, Kinked Pin	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
110-87-310-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	1,346	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-314-41-001101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	5,221	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
214-44-308-01-670800 CONN IC DIP SOCKET 8POS TIN Mill-Max Manufacturing Corp.	54,591	-	RFQ	Datasheet	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
D2808-42 CONN IC DIP SOCKET 8POS GOLD Harwin Inc.	29,484	-	RFQ	Datasheet	D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C

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