IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
36-6554-16

36-6554-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

1,591
RFQ
36-6554-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
550-80-361-18-101135

550-80-361-18-101135

PGA SOLDER TAIL

Preci-Dip

2,056
RFQ
550-80-361-18-101135

Datasheet

550 Bulk Active PGA 361 (18 x 18) 0.050" (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
192-PGM17043-10H

192-PGM17043-10H

CONN SOCKET PGA GOLD

Aries Electronics

4,507
RFQ
192-PGM17043-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
44-6556-41

44-6556-41

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

3,368
RFQ
44-6556-41

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
546-83-545-17-000147

546-83-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip

2,319
RFQ
546-83-545-17-000147

Datasheet

546 Bulk Active PGA 545 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
80-PRS13127-12

80-PRS13127-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,492
RFQ
80-PRS13127-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
546-83-296-19-131147

546-83-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip

2,504
RFQ
546-83-296-19-131147

Datasheet

546 Bulk Active PGA 296 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-500M30-001148

514-83-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

2,046
RFQ
514-83-500M30-001148

Datasheet

514 Bulk Active BGA 500 (30 x 30) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-420M26-001104

558-10-420M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

1,716
RFQ
558-10-420M26-001104

Datasheet

558 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
84-PRS11010-12

84-PRS11010-12

ZIF 11X11 84PIN FOOTPRN 11010

Aries Electronics

1,444
RFQ

-

PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
84-PLS10003-12

84-PLS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,071
RFQ
84-PLS10003-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS10003-12

84-PRS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,025
RFQ
84-PRS10003-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS11032-12

84-PRS11032-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,910
RFQ
84-PRS11032-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS12022-12

84-PRS12022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,477
RFQ
84-PRS12022-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS13053-12

84-PRS13053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,656
RFQ
84-PRS13053-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS13125-12

84-PRS13125-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,848
RFQ
84-PRS13125-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
514-83-504M29-001148

514-83-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

1,272
RFQ
514-83-504M29-001148

Datasheet

514 Bulk Active BGA 504 (29 x 29) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-420M26-001105

518-77-420M26-001105

CONN SOCKET PGA 420POS GOLD

Preci-Dip

3,816
RFQ
518-77-420M26-001105

Datasheet

518 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
514-87-652M35-001148

514-87-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip

2,265
RFQ
514-87-652M35-001148

Datasheet

514 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
44-3573-16

44-3573-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2,877
RFQ
44-3573-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
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