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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-255M16-001104BGA SURFACE MOUNT 1.27MM |
4,559 |
|
Datasheet |
558 | Bulk | Active | BGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-256M16-000104BGA SURFACE MOUNT 1.27MM |
4,990 |
|
Datasheet |
558 | Bulk | Active | BGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-256M20-001104BGA SURFACE MOUNT 1.27MM |
2,273 |
|
Datasheet |
558 | Bulk | Active | BGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-255M16-001105CONN SOCKET PGA 255POS GOLD |
3,396 |
|
Datasheet |
518 | Bulk | Active | PGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-272M20-001101PGA SOLDER TAIL 1.27MM |
1,160 |
|
Datasheet |
558 | Bulk | Active | PGA | 272 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-80-381-18-101135PGA SOLDER TAIL |
2,613 |
|
Datasheet |
550 | Bulk | Active | PGA | 381 (18 x 18) | 0.050" (1.27mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
220-2600-50-06023M TEXTOOL ZIP STRIP SOCKETS 220 |
4,586 |
|
- |
Textool™ | Box | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
|
518-77-256M16-000105CONN SOCKET PGA 256POS GOLD |
2,093 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-256M20-001105CONN SOCKET PGA 256POS GOLD |
3,704 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-400M20-000148CONN SOCKET BGA 400POS GOLD |
3,245 |
|
Datasheet |
514 | Bulk | Active | BGA | 400 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-292M20-001152BGA SOLDER TAIL |
4,112 |
|
Datasheet |
550 | Bulk | Active | BGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
APH-1136-G-RAPH-1136-G-R |
1,824 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1236-G-RAPH-1236-G-R |
3,784 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1736-G-RAPH-1736-G-R |
4,452 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1336-G-RAPH-1336-G-R |
1,905 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
550-10-420M26-001166BGA PIN ADAPTER 1.27MM SMD |
3,170 |
|
Datasheet |
550 | Bulk | Active | BGA | 420 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
2100-7243-00-1807CONN SOCKET PQFP 100POS TIN-LEAD |
1,135 |
|
Datasheet |
OEM | Bulk | Obsolete | QFP | 100 (4 x 25) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | 0°C ~ 105°C |
|
|
614-87-296-19-131144CONN SOCKET PGA 296POS GOLD |
3,167 |
|
Datasheet |
614 | Bulk | Active | PGA | 296 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-87-447-20-121147CONN SOCKET PGA 447POS GOLD |
3,428 |
|
Datasheet |
546 | Bulk | Active | PGA | 447 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-255M16-001106CONN SOCKET PGA 255POS GOLD |
2,642 |
|
Datasheet |
518 | Bulk | Active | PGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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