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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
126-41-964-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,293	-	RFQ	Datasheet	126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
126-91-964-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,859	-	RFQ	Datasheet	126	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
32-C212-21 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	4,414	-	RFQ	Datasheet	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
614-83-175-16-072112 CONN SOCKET PGA 175POS GOLD Preci-Dip	1,496	-	RFQ	Datasheet	614	Bulk	Active	PGA	175 (16 x 16)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
APH-1420-G-R APH-1420-G-R Samtec Inc.	1,236	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0520-G-R APH-0520-G-R Samtec Inc.	4,692	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1520-G-R APH-1520-G-R Samtec Inc.	2,753	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1120-G-R APH-1120-G-R Samtec Inc.	2,689	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0420-G-R APH-0420-G-R Samtec Inc.	4,188	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1320-G-R APH-1320-G-R Samtec Inc.	3,875	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-93-624-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,809	-	RFQ	-	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-13-044-08-031003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	4,421	-	RFQ	Datasheet	510	Bulk	Active	PGA	44 (8 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
48-3551-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	3,677	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-3552-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	4,124	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-6551-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	4,591	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-6552-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	1,582	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-6553-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	1,139	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-3554-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	3,949	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
116-43-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,327	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
127-43-764-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,790	-	RFQ	Datasheet	127	Tube	Active	DIP, 0.75" (19.05mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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