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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
116-43-648-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,528	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-93-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	1,851	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-43-964-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	4,671	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
104-13-964-41-770000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	4,803	-	RFQ	Datasheet	104	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic	-
111-43-952-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,002	-	RFQ	-	111	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-424-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,604	-	RFQ	-	116	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-624-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,011	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
44-3551-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	2,245	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-3552-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	2,192	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-3553-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	3,227	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-6551-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	4,557	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-3554-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	4,108	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-6554-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	1,867	-	RFQ	Datasheet	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
32-6508-212 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	4,011	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
32-6508-312 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	1,457	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
116-43-640-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,252	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-93-133-14-071001 CONN SOCKET PGA 133POS GOLD Mill-Max Manufacturing Corp.	1,888	-	RFQ	Datasheet	510	Tube	Active	PGA	133 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
117-93-430-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,687	-	RFQ	-	117	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	30 (2 x 15)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APO-422-G-H .100" LOW PROFILE SCREW MACHINE Samtec Inc.	1,772	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
38-3503-21 CONN IC DIP SOCKET 38POS GOLD Aries Electronics	2,797	-	RFQ	Datasheet	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C

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