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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
116-43-628-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,978	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-93-428-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	1,485	-	RFQ	-	116	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-93-628-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,489	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
124-93-650-41-002000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	4,993	-	RFQ	Datasheet	124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
124-93-950-41-002000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	2,496	-	RFQ	Datasheet	124	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
124-43-650-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,501	-	RFQ	Datasheet	124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
124-43-950-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,020	-	RFQ	Datasheet	124	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
38-0508-21 CONN SOCKET SIP 38POS GOLD Aries Electronics	3,598	-	RFQ	Datasheet	508	Bulk	Active	SIP	38 (1 x 38)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
38-0508-31 CONN SOCKET SIP 38POS GOLD Aries Electronics	2,929	-	RFQ	Datasheet	508	Bulk	Active	SIP	38 (1 x 38)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
123-13-642-41-001000 CONN IC DIP SOCKET 42POS GOLD Mill-Max Manufacturing Corp.	2,850	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-624-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,463	-	RFQ	-	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
38-1508-21 CONN IC DIP SOCKET 38POS GOLD Aries Electronics	4,768	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
38-1508-31 CONN IC DIP SOCKET 38POS GOLD Aries Electronics	1,452	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	38 (2 x 19)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
123-47-964-41-001000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3,955	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-93-324-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,419	-	RFQ	-	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-93-424-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,230	-	RFQ	-	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-93-624-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,893	-	RFQ	-	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-43-424-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,775	-	RFQ	-	115	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APA-628-G-C ADAPTER PLUG Samtec Inc.	3,199	-	RFQ	Datasheet	APA	Bulk	Active	-	28 (2 x 14)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
HLS-0316-G-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	4,669	-	RFQ	Datasheet	HLS	Tube	Active	SIP	48 (3 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C

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