IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
612-91-652-41-004000

612-91-652-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,049
RFQ
612-91-652-41-004000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1940-T-H

APH-1940-T-H

APH-1940-T-H

Samtec Inc.

4,203
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1140-T-H

APH-1140-T-H

APH-1140-T-H

Samtec Inc.

3,872
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0240-T-H

APH-0240-T-H

APH-0240-T-H

Samtec Inc.

1,749
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0640-T-H

APH-0640-T-H

APH-0640-T-H

Samtec Inc.

4,129
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1240-T-H

APH-1240-T-H

APH-1240-T-H

Samtec Inc.

2,399
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0340-T-H

APH-0340-T-H

APH-0340-T-H

Samtec Inc.

2,607
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-93-964-41-003000

116-93-964-41-003000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

4,838
RFQ
116-93-964-41-003000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-964-41-003000

116-43-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,373
RFQ
116-43-964-41-003000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-324-61-007000

116-43-324-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,348
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-624-61-007000

116-43-624-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,622
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-624-61-007000

116-93-624-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,068
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-640-61-003000

115-93-640-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,472
RFQ

-

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-83-325-18-111111

517-83-325-18-111111

CONN SOCKET PGA 325POS GOLD

Preci-Dip

3,159
RFQ
517-83-325-18-111111

Datasheet

517 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-93-950-41-001000

612-93-950-41-001000

SOCKET CARRIER SLDRTL .900 50POS

Mill-Max Manufacturing Corp.

2,379
RFQ
612-93-950-41-001000

Datasheet

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-950-41-001000

612-43-950-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,417
RFQ
612-43-950-41-001000

Datasheet

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-83-175-16-071117

514-83-175-16-071117

CONN SOCKET PGA 175POS GOLD

Preci-Dip

2,949
RFQ
514-83-175-16-071117

Datasheet

514 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
126-41-952-41-002000

126-41-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,497
RFQ
126-41-952-41-002000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-952-41-002000

126-91-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,635
RFQ
126-91-952-41-002000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
60-9503-20

60-9503-20

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

2,687
RFQ
60-9503-20

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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