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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
48-6572-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	2,067	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-6573-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	3,861	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-6575-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	4,102	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
32-0508-21 CONN SOCKET SIP 32POS GOLD Aries Electronics	3,927	-	RFQ	Datasheet	508	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
32-0508-31 CONN SOCKET SIP 32POS GOLD Aries Electronics	2,331	-	RFQ	Datasheet	508	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
APO-640-G-A .100" LOW PROFILE SCREW MACHINE Samtec Inc.	2,875	-	RFQ	Datasheet	APO	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
123-11-432-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,383	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-11-632-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,291	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-43-316-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,305	-	RFQ	-	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
32-1508-21 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	4,654	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
32-1508-31 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	4,353	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
24-3508-212 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,804	-	RFQ	Datasheet	508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
48-6556-11 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	3,962	-	RFQ	Datasheet	6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
612-93-642-41-001000 SOCKET CARRIER SLDRTL .600 42POS Mill-Max Manufacturing Corp.	2,397	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-43-642-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3,103	-	RFQ	Datasheet	612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-44-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,321	-	RFQ	-	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-99-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,298	-	RFQ	-	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	4,526	-	RFQ	-	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
517-87-428-19-101111 CONN SOCKET PGA 428POS GOLD Preci-Dip	2,739	-	RFQ	Datasheet	517	Bulk	Active	PGA	428 (19 x 19)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
510-93-012-05-001001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,118	-	RFQ	Datasheet	510	Tube	Active	PGA	12 (5 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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