IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0636-T-H

APH-0636-T-H

APH-0636-T-H

Samtec Inc.

2,318
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1136-T-H

APH-1136-T-H

APH-1136-T-H

Samtec Inc.

4,302
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1336-T-H

APH-1336-T-H

APH-1336-T-H

Samtec Inc.

1,559
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0436-T-H

APH-0436-T-H

APH-0436-T-H

Samtec Inc.

1,891
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1236-T-H

APH-1236-T-H

APH-1236-T-H

Samtec Inc.

3,775
RFQ

-

* - Active - - - - - - - - - - - - - - -
34-0501-21

34-0501-21

CONN SOCKET SIP 34POS GOLD

Aries Electronics

4,204
RFQ
34-0501-21

Datasheet

501 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
34-0501-31

34-0501-31

CONN SOCKET SIP 34POS GOLD

Aries Electronics

4,694
RFQ
34-0501-31

Datasheet

501 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-43-324-61-001000

110-43-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,858
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-624-61-001000

110-43-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,211
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-324-61-001000

110-99-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,479
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-624-61-001000

110-99-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,762
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
48-6511-11

48-6511-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3,372
RFQ
48-6511-11

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
126-41-432-41-001000

126-41-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,578
RFQ
126-41-432-41-001000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-632-41-001000

126-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,775
RFQ
126-41-632-41-001000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-432-41-001000

126-91-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,139
RFQ
126-91-432-41-001000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-632-41-001000

126-91-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,369
RFQ
126-91-632-41-001000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-132-41-012000

346-93-132-41-012000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.

3,432
RFQ
346-93-132-41-012000

Datasheet

346 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-328-41-001000

612-41-328-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,054
RFQ
612-41-328-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-428-41-001000

612-41-428-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,972
RFQ
612-41-428-41-001000

Datasheet

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-628-41-001000

612-41-628-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,699
RFQ
612-41-628-41-001000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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