IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-43-624-41-007000

116-43-624-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,491
RFQ
116-43-624-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-648-NGT

ICO-648-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,185
RFQ
ICO-648-NGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0409-G-2

HLS-0409-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,453
RFQ
HLS-0409-G-2

Datasheet

HLS Bulk Active SIP 36 (4 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
APH-0432-T-T

APH-0432-T-T

APH-0432-T-T

Samtec Inc.

1,711
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1432-T-T

APH-1432-T-T

APH-1432-T-T

Samtec Inc.

4,197
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1932-T-T

APH-1932-T-T

APH-1932-T-T

Samtec Inc.

2,852
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1032-T-T

APH-1032-T-T

APH-1032-T-T

Samtec Inc.

4,667
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1532-T-T

APH-1532-T-T

APH-1532-T-T

Samtec Inc.

1,781
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1632-T-T

APH-1632-T-T

APH-1632-T-T

Samtec Inc.

1,904
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1332-T-T

APH-1332-T-T

APH-1332-T-T

Samtec Inc.

3,179
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1732-T-T

APH-1732-T-T

APH-1732-T-T

Samtec Inc.

1,181
RFQ

-

* - Active - - - - - - - - - - - - - - -
115-93-636-41-001000

115-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

3,371
RFQ
115-93-636-41-001000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-636-41-001000

115-43-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,312
RFQ
115-43-636-41-001000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-148-31-018000

714-43-148-31-018000

CONN SOCKET SIP 48POS GOLD

Mill-Max Manufacturing Corp.

2,446
RFQ
714-43-148-31-018000

Datasheet

714 Bulk Active SIP 48 (1 x 48) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-41-640-41-005000

117-41-640-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,295
RFQ
117-41-640-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-91-640-41-005000

117-91-640-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,139
RFQ
117-91-640-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-320-41-001000

614-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3,808
RFQ
614-93-320-41-001000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-420-41-001000

614-93-420-41-001000

SOCKET CARRIER LOWPRO .400 20POS

Mill-Max Manufacturing Corp.

4,622
RFQ
614-93-420-41-001000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-320-41-001000

614-43-320-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,690
RFQ
614-43-320-41-001000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-420-41-001000

614-43-420-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,585
RFQ
614-43-420-41-001000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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