IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
114-93-428-41-117000

114-93-428-41-117000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,214
RFQ
114-93-428-41-117000

Datasheet

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-93-628-41-117000

114-93-628-41-117000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,084
RFQ
114-93-628-41-117000

Datasheet

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-328-41-117000

114-43-328-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,779
RFQ
114-43-328-41-117000

Datasheet

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-428-41-117000

114-43-428-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,645
RFQ
114-43-428-41-117000

Datasheet

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-43-628-41-117000

114-43-628-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,889
RFQ
114-43-628-41-117000

Datasheet

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-210-41-003000

612-43-210-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,511
RFQ
612-43-210-41-003000

Datasheet

612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-210-41-003000

612-93-210-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,888
RFQ
612-93-210-41-003000

Datasheet

612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICF-328-STL-O

ICF-328-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,909
RFQ
ICF-328-STL-O

Datasheet

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-628-STL-I

ICF-628-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,879
RFQ
ICF-628-STL-I

Datasheet

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
605-93-318-11-480000

605-93-318-11-480000

SOCKET CARRIER LOWPRO .300 18POS

Mill-Max Manufacturing Corp.

3,670
RFQ
605-93-318-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-43-318-11-480000

605-43-318-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,711
RFQ
605-43-318-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-316-31-018000

614-93-316-31-018000

SOCKET CARRIER LOWPRO .300 16POS

Mill-Max Manufacturing Corp.

2,547
RFQ
614-93-316-31-018000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-316-31-018000

614-43-316-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,602
RFQ
614-43-316-31-018000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0218-G-2

HLS-0218-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,371
RFQ
HLS-0218-G-2

Datasheet

HLS Tube Active SIP 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
116-41-322-41-008000

116-41-322-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,049
RFQ
116-41-322-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-322-41-008000

116-91-322-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,133
RFQ
116-91-322-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-422-41-008000

116-91-422-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,520
RFQ
116-91-422-41-008000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-320-G-C

APA-320-G-C

ADAPTER PLUG

Samtec Inc.

3,200
RFQ
APA-320-G-C

Datasheet

APA Bulk Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-320-G-C

APO-320-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,439
RFQ
APO-320-G-C

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
HLS-0413-T-2

HLS-0413-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,596
RFQ
HLS-0413-T-2

Datasheet

HLS Bulk Active SIP 52 (4 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER