IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
114-43-624-41-117000

114-43-624-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,478
RFQ
114-43-624-41-117000

Datasheet

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0314-G-2

HLS-0314-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,635
RFQ
HLS-0314-G-2

Datasheet

HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICA-648-ATT

ICA-648-ATT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,741
RFQ
ICA-648-ATT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
14-0511-11

14-0511-11

CONN SOCKET SIP 14POS GOLD

Aries Electronics

4,799
RFQ
14-0511-11

Datasheet

511 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
29-0501-20

29-0501-20

CONN SOCKET SIP 29POS TIN

Aries Electronics

2,776
RFQ
29-0501-20

Datasheet

501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
29-0501-30

29-0501-30

CONN SOCKET SIP 29POS TIN

Aries Electronics

2,482
RFQ
29-0501-30

Datasheet

501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-41-210-31-018000

614-41-210-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,084
RFQ
614-41-210-31-018000

Datasheet

614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-210-31-018000

614-91-210-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,974
RFQ
614-91-210-31-018000

Datasheet

614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-83-085-11-041112

614-83-085-11-041112

CONN SOCKET PGA 85POS GOLD

Preci-Dip

4,618
RFQ
614-83-085-11-041112

Datasheet

614 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0314-T-31

HLS-0314-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,170
RFQ
HLS-0314-T-31

Datasheet

HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
714-43-224-31-018000

714-43-224-31-018000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,998
RFQ
714-43-224-31-018000

Datasheet

714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-516-11S

24-516-11S

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,477
RFQ
24-516-11S

Datasheet

516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-624-ZWGG-2

ICA-624-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,394
RFQ
ICA-624-ZWGG-2

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
23-0501-21

23-0501-21

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,538
RFQ
23-0501-21

Datasheet

501 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
23-0501-31

23-0501-31

CONN SOCKET SIP 23POS GOLD

Aries Electronics

1,510
RFQ
23-0501-31

Datasheet

501 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
26-71250-10

26-71250-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,937
RFQ
26-71250-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-7500-10

26-7500-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

2,155
RFQ
26-7500-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
146-41-422-41-013000

146-41-422-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

1,963
RFQ
146-41-422-41-013000

Datasheet

146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-422-41-013000

146-91-422-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2,351
RFQ
146-91-422-41-013000

Datasheet

146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-322-41-007000

116-47-322-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,867
RFQ
116-47-322-41-007000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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