IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
146-41-316-41-013000

146-41-316-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,504
RFQ
146-41-316-41-013000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-316-41-013000

146-91-316-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2,640
RFQ
146-91-316-41-013000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-43-113-41-005000

317-43-113-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

1,689
RFQ
317-43-113-41-005000

Datasheet

317 Bulk Active SIP 13 (1 x 13) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-324-G-A

APA-324-G-A

ADAPTER PLUG

Samtec Inc.

3,527
RFQ
APA-324-G-A

Datasheet

APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
HLS-0413-S-2

HLS-0413-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,567
RFQ
HLS-0413-S-2

Datasheet

HLS Bulk Active SIP 52 (4 x 13) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APO-624-G-A

APO-624-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,255
RFQ
APO-624-G-A

Datasheet

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-324-G-A

APO-324-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,572
RFQ
APO-324-G-A

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0508-G-R

APH-0508-G-R

APH-0508-G-R

Samtec Inc.

2,098
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1308-G-R

APH-1308-G-R

APH-1308-G-R

Samtec Inc.

2,772
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1208-G-R

APH-1208-G-R

APH-1208-G-R

Samtec Inc.

2,570
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0908-G-R

APH-0908-G-R

APH-0908-G-R

Samtec Inc.

3,533
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1408-G-R

APH-1408-G-R

APH-1408-G-R

Samtec Inc.

4,953
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1708-G-R

APH-1708-G-R

APH-1708-G-R

Samtec Inc.

1,170
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0708-G-R

APH-0708-G-R

APH-0708-G-R

Samtec Inc.

1,991
RFQ

-

* - Active - - - - - - - - - - - - - - -
510-83-241-19-101101

510-83-241-19-101101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

1,447
RFQ
510-83-241-19-101101

Datasheet

510 Bulk Active PGA 241 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-1508-21

20-1508-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,261
RFQ
20-1508-21

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
20-1508-31

20-1508-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,965
RFQ
20-1508-31

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
116-47-316-41-007000

116-47-316-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,044
RFQ
116-47-316-41-007000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-93-114-41-005000

317-93-114-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

1,323
RFQ
317-93-114-41-005000

Datasheet

317 Bulk Active SIP 14 (1 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-318-41-003000

116-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,486
RFQ
116-41-318-41-003000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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