IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0218-T-R

APH-0218-T-R

APH-0218-T-R

Samtec Inc.

4,010
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1318-T-R

APH-1318-T-R

APH-1318-T-R

Samtec Inc.

2,692
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-47-324-41-105000

110-47-324-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

4,431
RFQ
110-47-324-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-424-41-105000

110-47-424-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,081
RFQ
110-47-424-41-105000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-624-41-105000

110-47-624-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,113
RFQ
110-47-624-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-310-41-007000

116-93-310-41-007000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,321
RFQ
116-93-310-41-007000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-310-41-007000

116-43-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,269
RFQ
116-43-310-41-007000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-41-310-11-480000

605-41-310-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

4,382
RFQ
605-41-310-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-91-310-11-480000

605-91-310-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,101
RFQ
605-91-310-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-316-41-105000

110-41-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,361
RFQ
110-41-316-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-316-41-105000

110-91-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,504
RFQ
110-91-316-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
80-PGM12015-10

80-PGM12015-10

CONN SOCKET PGA GOLD

Aries Electronics

2,438
RFQ
80-PGM12015-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0524-T-H

APH-0524-T-H

APH-0524-T-H

Samtec Inc.

3,677
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0924-T-H

APH-0924-T-H

APH-0924-T-H

Samtec Inc.

2,070
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1924-T-H

APH-1924-T-H

APH-1924-T-H

Samtec Inc.

2,322
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1424-T-H

APH-1424-T-H

APH-1424-T-H

Samtec Inc.

4,398
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1524-T-H

APH-1524-T-H

APH-1524-T-H

Samtec Inc.

2,025
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1124-T-H

APH-1124-T-H

APH-1124-T-H

Samtec Inc.

3,930
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1324-T-H

APH-1324-T-H

APH-1324-T-H

Samtec Inc.

4,576
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0324-T-H

APH-0324-T-H

APH-0324-T-H

Samtec Inc.

2,092
RFQ

-

* - Active - - - - - - - - - - - - - - -
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