IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
ICO-324-MGG

ICO-324-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,197
RFQ
ICO-324-MGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
299-93-624-10-002000

299-93-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

4,419
RFQ
299-93-624-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-624-10-002000

299-43-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

1,504
RFQ
299-43-624-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0311-T-11

HLS-0311-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,265
RFQ
HLS-0311-T-11

Datasheet

HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
32-6501-20

32-6501-20

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

4,814
RFQ
32-6501-20

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-6501-30

32-6501-30

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

3,275
RFQ
32-6501-30

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
18-3501-21

18-3501-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,932
RFQ
18-3501-21

Datasheet

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-93-304-61-001000

110-93-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,836
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
23-0508-30

23-0508-30

CONN SOCKET SIP 23POS GOLD

Aries Electronics

1,383
RFQ
23-0508-30

Datasheet

508 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
210-44-306-41-001000

210-44-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,408
RFQ
210-44-306-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-99-306-41-001000

210-99-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,892
RFQ
210-99-306-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-168-17-001101

510-83-168-17-001101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

2,236
RFQ
510-83-168-17-001101

Datasheet

510 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
15-7350-10

15-7350-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,503
RFQ
15-7350-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-7450-10

15-7450-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

1,810
RFQ
15-7450-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-7500-10

15-7500-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

1,539
RFQ
15-7500-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-7540-10

15-7540-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

1,267
RFQ
15-7540-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-7635-10

15-7635-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

4,719
RFQ
15-7635-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-7695-10

15-7695-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

2,792
RFQ
15-7695-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-7850-10

15-7850-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

2,805
RFQ
15-7850-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-6810-90TWR

10-6810-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

4,649
RFQ
10-6810-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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