IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1510-T-H

APH-1510-T-H

APH-1510-T-H

Samtec Inc.

4,735
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1810-T-H

APH-1810-T-H

APH-1810-T-H

Samtec Inc.

4,729
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0410-T-H

APH-0410-T-H

APH-0410-T-H

Samtec Inc.

4,441
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0810-T-H

APH-0810-T-H

APH-0810-T-H

Samtec Inc.

3,016
RFQ

-

* - Active - - - - - - - - - - - - - - -
510-83-149-15-003101

510-83-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

4,760
RFQ
510-83-149-15-003101

Datasheet

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-149-15-061101

510-83-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

1,753
RFQ
510-83-149-15-061101

Datasheet

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-149-15-064101

510-83-149-15-064101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

1,484
RFQ
510-83-149-15-064101

Datasheet

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
15-0501-30

15-0501-30

CONN SOCKET SIP 15POS TIN

Aries Electronics

1,164
RFQ
15-0501-30

Datasheet

501 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-6503-20

22-6503-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,365
RFQ
22-6503-20

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-6503-30

22-6503-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,335
RFQ
22-6503-30

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-C212-10H

32-C212-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,580
RFQ
32-C212-10H

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-652-41-001101

116-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

1,896
RFQ
116-83-652-41-001101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-316-T -N

APA-316-T -N

.100" SCREW MACHINE DIP ADAPTOR

Samtec Inc.

2,741
RFQ

-

* - Active - - - - - - - - - - - - - - -
510-83-145-17-001101

510-83-145-17-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

3,018
RFQ
510-83-145-17-001101

Datasheet

510 Bulk Active PGA 145 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
30-6513-11H

30-6513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

1,867
RFQ
30-6513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APO-628-G-J

APO-628-G-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,281
RFQ
APO-628-G-J

Datasheet

APO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
20-6511-11

20-6511-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,805
RFQ
20-6511-11

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APO-316-G-A1

APO-316-G-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,182
RFQ
APO-316-G-A1

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICF-648-TL-I

ICF-648-TL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

4,497
RFQ
ICF-648-TL-I

Datasheet

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
HLS-0708-TT-2

HLS-0708-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,937
RFQ
HLS-0708-TT-2

Datasheet

HLS Bulk Active SIP 56 (7 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
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