IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
126-93-304-41-003000

126-93-304-41-003000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

4,303
RFQ
126-93-304-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-304-41-003000

126-43-304-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,005
RFQ
126-43-304-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
14-6501-21

14-6501-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,115
RFQ
14-6501-21

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-6501-31

14-6501-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,562
RFQ
14-6501-31

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-83-144-15-001101

510-83-144-15-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

4,465
RFQ
510-83-144-15-001101

Datasheet

510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-3518-11H

28-3518-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,640
RFQ
28-3518-11H

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-83-160-15-061101

510-83-160-15-061101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

4,805
RFQ
510-83-160-15-061101

Datasheet

510 Bulk Active PGA 160 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-160-13-001101

510-83-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

1,107
RFQ
510-83-160-13-001101

Datasheet

510 Bulk Active PGA 160 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-160-14-001101

510-83-160-14-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

2,121
RFQ
510-83-160-14-001101

Datasheet

510 Bulk Active PGA 160 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0209-G-38

HLS-0209-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,284
RFQ
HLS-0209-G-38

Datasheet

HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-83-160-16-081101

510-83-160-16-081101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

4,057
RFQ
510-83-160-16-081101

Datasheet

510 Bulk Active PGA 160 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
124-41-304-41-002000

124-41-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,432
RFQ
124-41-304-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-304-41-002000

124-91-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,989
RFQ
124-91-304-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
11-71000-10

11-71000-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

2,651
RFQ
11-71000-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
11-7400-10

11-7400-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

1,289
RFQ
11-7400-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
11-7587-10

11-7587-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

1,493
RFQ
11-7587-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-6621-30

08-6621-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2,599
RFQ
08-6621-30

Datasheet

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-0501-30

09-0501-30

CONN SOCKET SIP 9POS TIN

Aries Electronics

3,514
RFQ
09-0501-30

Datasheet

501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICO-320-CGG

ICO-320-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,774
RFQ
ICO-320-CGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
546-87-085-11-002135

546-87-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip

4,328
RFQ
546-87-085-11-002135

Datasheet

546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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