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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
10-71250-10 CONN SOCKET SIP 10POS TIN Aries Electronics	4,899	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7350-10 CONN SOCKET SIP 10POS TIN Aries Electronics	2,306	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7400-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,831	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7410-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,239	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7450-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,701	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7475-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,791	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7500-10 CONN SOCKET SIP 10POS TIN Aries Electronics	2,850	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7550-10 CONN SOCKET SIP 10POS TIN Aries Electronics	1,881	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7560-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,852	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7600-10 CONN SOCKET SIP 10POS TIN Aries Electronics	4,620	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7775-10 CONN SOCKET SIP 10POS TIN Aries Electronics	2,542	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7860-10 CONN SOCKET SIP 10POS TIN Aries Electronics	1,850	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-7925-10 CONN SOCKET SIP 10POS TIN Aries Electronics	4,626	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-4810-90C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	4,582	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
10-6810-90C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	4,030	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
ICO-632-ZSGT .100" LOW PROFILE SCREW MACHINE Samtec Inc.	1,405	-	RFQ	Datasheet	ICO	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
116-83-432-41-013101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	1,934	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0404-T-10 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	4,457	-	RFQ	Datasheet	HLS	Bulk	Active	SIP	16 (4 x 4)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
550-80-068-10-061101 PGA SOLDER TAIL Preci-Dip	3,485	-	RFQ	Datasheet	550	Bulk	Active	PGA	68 (10 x 10)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
840-AG11D CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	3,054	-	RFQ	Datasheet	800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C

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