IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
ICF-328-S-O-TR

ICF-328-S-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,526
RFQ
ICF-328-S-O-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
08-6501-31

08-6501-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,676
RFQ
08-6501-31

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
08-0508-21

08-0508-21

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3,802
RFQ
08-0508-21

Datasheet

508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
08-0508-31

08-0508-31

CONN SOCKET SIP 8POS GOLD

Aries Electronics

4,982
RFQ
08-0508-31

Datasheet

508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
08-1508-21

08-1508-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

4,503
RFQ
08-1508-21

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
08-1508-31

08-1508-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,573
RFQ
08-1508-31

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
10-2820-90

10-2820-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,354
RFQ
10-2820-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
ICA-628-WTT-2

ICA-628-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,052
RFQ
ICA-628-WTT-2

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
PGA179H012B1-1836R

PGA179H012B1-1836R

PGA SOCKET 179 CTS

Amphenol ICC (FCI)

3,199
RFQ
PGA179H012B1-1836R

Datasheet

- - Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
1-1571550-0

1-1571550-0

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

1,838
RFQ
1-1571550-0

Datasheet

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
614-83-952-31-012101

614-83-952-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2,593
RFQ
614-83-952-31-012101

Datasheet

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-100-13-064101

510-83-100-13-064101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

2,451
RFQ
510-83-100-13-064101

Datasheet

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-648-41-018101

116-83-648-41-018101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,480
RFQ
116-83-648-41-018101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-668-41-005101

117-83-668-41-005101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip

1,044
RFQ
117-83-668-41-005101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-0501-21

08-0501-21

CONN SOCKET SIP 8POS GOLD

Aries Electronics

1,782
RFQ
08-0501-21

Datasheet

501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
08-0501-31

08-0501-31

CONN SOCKET SIP 8POS GOLD

Aries Electronics

4,779
RFQ
08-0501-31

Datasheet

501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
HLS-0208-G-2

HLS-0208-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,550
RFQ
HLS-0208-G-2

Datasheet

HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
146-83-642-41-035101

146-83-642-41-035101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

4,415
RFQ
146-83-642-41-035101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-642-41-036101

146-83-642-41-036101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

4,424
RFQ
146-83-642-41-036101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
532-AG10D

532-AG10D

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

3,874
RFQ
532-AG10D

Datasheet

500 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Polyester -55°C ~ 125°C
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