IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-6518-102

24-6518-102

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,730
RFQ
24-6518-102

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-155-16-003101

510-87-155-16-003101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

1,860
RFQ
510-87-155-16-003101

Datasheet

510 Bulk Active PGA 155 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-155-16-093101

510-87-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

2,112
RFQ
510-87-155-16-093101

Datasheet

510 Bulk Active PGA 155 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-83-616-10-002101

299-83-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,978
RFQ
299-83-616-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
3-822516-6

3-822516-6

CONN SOCKET PLCC 84POS TIN

TE Connectivity AMP Connectors

4,556
RFQ
3-822516-6

Datasheet

- Tape & Reel (TR) Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
HLS-0114-T-15

HLS-0114-T-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,848
RFQ
HLS-0114-T-15

Datasheet

HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
06-3503-31

06-3503-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,571
RFQ
06-3503-31

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
08-6823-90T

08-6823-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2,310
RFQ
08-6823-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
1-1437540-4

1-1437540-4

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

2,837
RFQ
1-1437540-4

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
28-6518-10H

28-6518-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,257
RFQ
28-6518-10H

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-318-ATT

ICA-318-ATT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,775
RFQ
ICA-318-ATT

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
28-3518-10H

28-3518-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,106
RFQ
28-3518-10H

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-156-16-001101

510-87-156-16-001101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3,205
RFQ
510-87-156-16-001101

Datasheet

510 Bulk Active PGA 156 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-156-16-091101

510-87-156-16-091101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3,706
RFQ
510-87-156-16-091101

Datasheet

510 Bulk Active PGA 156 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-160-14-001101

510-87-160-14-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

3,914
RFQ
510-87-160-14-001101

Datasheet

510 Bulk Active PGA 160 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
C9128-00

C9128-00

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,454
RFQ
C9128-00

Datasheet

Edge-Grip™, C91 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
26-6513-11

26-6513-11

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

4,528
RFQ
26-6513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-820-90WR

08-820-90WR

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,277
RFQ
08-820-90WR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
APO-316-G-J

APO-316-G-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,803
RFQ
APO-316-G-J

Datasheet

APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
8058-1G23

8058-1G23

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

2,183
RFQ
8058-1G23

Datasheet

8058 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
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