IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
510-87-128-13-041101

510-87-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

1,047
RFQ
510-87-128-13-041101

Datasheet

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-128-13-042101

510-87-128-13-042101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

1,434
RFQ
510-87-128-13-042101

Datasheet

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-128-13-043101

510-87-128-13-043101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

3,030
RFQ
510-87-128-13-043101

Datasheet

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-128-13-071101

510-87-128-13-071101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

1,845
RFQ
510-87-128-13-071101

Datasheet

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
09-0511-10

09-0511-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

3,139
RFQ
09-0511-10

Datasheet

511 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-322-41-004101

116-83-322-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

1,159
RFQ
116-83-322-41-004101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-422-41-004101

116-83-422-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,380
RFQ
116-83-422-41-004101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-628-41-105191

110-83-628-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,423
RFQ

-

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-640-31-012101

614-83-640-31-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,976
RFQ
614-83-640-31-012101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0508-21

05-0508-21

CONN SOCKET SIP 5POS GOLD

Aries Electronics

4,612
RFQ
05-0508-21

Datasheet

508 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
05-0508-31

05-0508-31

CONN SOCKET SIP 5POS GOLD

Aries Electronics

1,130
RFQ
05-0508-31

Datasheet

508 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
ICO-318-SGT-L

ICO-318-SGT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,817
RFQ
ICO-318-SGT-L

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0115-S-2

HLS-0115-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,697
RFQ
HLS-0115-S-2

Datasheet

HLS Tube Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICF-624-TM-O

ICF-624-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

3,031
RFQ
ICF-624-TM-O

Datasheet

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
824-AG10D

824-AG10D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

1,067
RFQ
824-AG10D

Datasheet

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
116-87-636-41-002101

116-87-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,241
RFQ
116-87-636-41-002101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-075-11-001101

510-83-075-11-001101

CONN SOCKET PGA 75POS GOLD

Preci-Dip

4,004
RFQ
510-83-075-11-001101

Datasheet

510 Bulk Active PGA 75 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-648-41-117101

114-83-648-41-117101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

1,299
RFQ
114-83-648-41-117101

Datasheet

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-316-T-A

APA-316-T-A

ADAPTER PLUG

Samtec Inc.

1,484
RFQ
APA-316-T-A

Datasheet

APA Bulk Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
HLS-0206-G-2

HLS-0206-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,523
RFQ
HLS-0206-G-2

Datasheet

HLS Tube Active SIP 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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