IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
115-83-648-41-001101

115-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,760
RFQ

-

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-065-10-051101

510-83-065-10-051101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

3,046
RFQ
510-83-065-10-051101

Datasheet

510 Bulk Active PGA 65 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0304-T-10

HLS-0304-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,951
RFQ
HLS-0304-T-10

Datasheet

HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-316-41-013101

116-87-316-41-013101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,618
RFQ
116-87-316-41-013101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-3518-102

14-3518-102

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,239
RFQ
14-3518-102

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-3518-111

14-3518-111

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,342
RFQ
14-3518-111

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-324-41-001101

116-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,994
RFQ
116-83-324-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-648-41-018101

116-87-648-41-018101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

4,943
RFQ
116-87-648-41-018101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-322-41-011101

116-83-322-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,736
RFQ
116-83-322-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0904-T-R

APH-0904-T-R

APH-0904-T-R

Samtec Inc.

1,849
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1504-T-R

APH-1504-T-R

APH-1504-T-R

Samtec Inc.

4,038
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1104-T-R

APH-1104-T-R

APH-1104-T-R

Samtec Inc.

1,645
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0204-T-R

APH-0204-T-R

APH-0204-T-R

Samtec Inc.

3,112
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1704-T-R

APH-1704-T-R

APH-1704-T-R

Samtec Inc.

1,624
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1804-T-R

APH-1804-T-R

APH-1804-T-R

Samtec Inc.

1,783
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1304-T-R

APH-1304-T-R

APH-1304-T-R

Samtec Inc.

3,047
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0804-T-R

APH-0804-T-R

APH-0804-T-R

Samtec Inc.

4,884
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0304-T-R

APH-0304-T-R

APH-0304-T-R

Samtec Inc.

2,280
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0404-T-R

APH-0404-T-R

APH-0404-T-R

Samtec Inc.

3,750
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-83-328-41-002101

116-83-328-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,908
RFQ
116-83-328-41-002101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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