IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
16-3518-10H

16-3518-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,923
RFQ
16-3518-10H

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
27-0518-10H

27-0518-10H

CONN SOCKET SIP 27POS GOLD

Aries Electronics

2,421
RFQ
27-0518-10H

Datasheet

518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-822-90T

08-822-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3,339
RFQ
08-822-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
612-87-650-41-001101

612-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

4,432
RFQ
612-87-650-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-314-WTT-2

ICA-314-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,141
RFQ
ICA-314-WTT-2

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
3-1437536-4

3-1437536-4

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

1,411
RFQ
3-1437536-4

Datasheet

500 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
612-83-632-41-001101

612-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,631
RFQ
612-83-632-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-83-314-10-001101

299-83-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1,926
RFQ
299-83-314-10-001101

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-632-41-008101

116-87-632-41-008101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,734
RFQ
116-87-632-41-008101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-328-STL-O-TR

ICF-328-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,893
RFQ
ICF-328-STL-O-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
C8124-04

C8124-04

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

1,265
RFQ
C8124-04

Datasheet

Edge-Grip™, C81 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-3513-10T

30-3513-10T

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

4,646
RFQ
30-3513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-93-316-41-005000

117-93-316-41-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,434
RFQ
117-93-316-41-005000

Datasheet

117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-318-ZSST

ICO-318-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,233
RFQ
ICO-318-ZSST

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
121-83-428-41-001101

121-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,863
RFQ
121-83-428-41-001101

Datasheet

121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-628-41-001101

116-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,616
RFQ
116-87-628-41-001101

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-428-41-105101

110-83-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,491
RFQ
110-83-428-41-105101

Datasheet

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-640-41-117101

114-83-640-41-117101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,607
RFQ
114-83-640-41-117101

Datasheet

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-640-41-134161

114-83-640-41-134161

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,565
RFQ
114-83-640-41-134161

Datasheet

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-624-T-I

ICF-624-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,003
RFQ
ICF-624-T-I

Datasheet

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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