IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
7-1437536-2

7-1437536-2

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors

1,434
RFQ
7-1437536-2

Datasheet

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
114-83-642-41-117101

114-83-642-41-117101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,541
RFQ
114-83-642-41-117101

Datasheet

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-316-F-O

ICF-316-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

4,407
RFQ
ICF-316-F-O

Datasheet

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-316-F-I

ICF-316-F-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,410
RFQ
ICF-316-F-I

Datasheet

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
116-83-624-41-002101

116-83-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,831
RFQ
116-83-624-41-002101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-T-31

HLS-0204-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,925
RFQ
HLS-0204-T-31

Datasheet

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
04-0503-21

04-0503-21

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,134
RFQ
04-0503-21

Datasheet

0503 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
28-0518-10T

28-0518-10T

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,895
RFQ
28-0518-10T

Datasheet

518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-1518-10T

28-1518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,075
RFQ
28-1518-10T

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-3513-10T

22-3513-10T

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,690
RFQ
22-3513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0205-T-11

HLS-0205-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,226
RFQ
HLS-0205-T-11

Datasheet

HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APO-308-T-T

APO-308-T-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,060
RFQ
APO-308-T-T

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
24-3518-11

24-3518-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,623
RFQ
24-3518-11

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-096-14-091101

510-87-096-14-091101

CONN SOCKET PGA 96POS GOLD

Preci-Dip

3,934
RFQ
510-87-096-14-091101

Datasheet

510 Bulk Active PGA 96 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-101-11-001101

510-87-101-11-001101

CONN SOCKET PGA 101POS GOLD

Preci-Dip

1,802
RFQ
510-87-101-11-001101

Datasheet

510 Bulk Active PGA 101 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-624-41-801101

110-83-624-41-801101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,211
RFQ
110-83-624-41-801101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-088-13-062101

510-87-088-13-062101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

2,647
RFQ
510-87-088-13-062101

Datasheet

510 Bulk Active PGA 88 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-088-13-081101

510-87-088-13-081101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

3,601
RFQ
510-87-088-13-081101

Datasheet

510 Bulk Active PGA 88 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-632-41-036101

146-87-632-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,066
RFQ
146-87-632-41-036101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0113-T-2

HLS-0113-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,527
RFQ
HLS-0113-T-2

Datasheet

HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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