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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
214-44-306-01-670799STANDRD SOLDER TAIL DIP SOCKET |
1,334 |
|
- |
214 | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
|
|
21-0513-10TCONN SOCKET SIP 21POS GOLD |
3,557 |
|
Datasheet |
0513 | Bulk | Active | SIP | 21 (1 x 21) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
23-0518-10HCONN SOCKET SIP 23POS GOLD |
4,784 |
|
Datasheet |
518 | Bulk | Active | SIP | 23 (1 x 23) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
121-83-624-41-001101CONN IC DIP SOCKET 24POS GOLD |
4,249 |
|
Datasheet |
121 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-87-628-41-002101CONN IC DIP SOCKET 28POS GOLD |
1,895 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
ICO-320-LTT.100" LOW PROFILE SCREW MACHINE |
3,729 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
822-AG11DCONN IC DIP SOCKET 22POS GOLD |
3,958 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
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|
346-43-109-41-013000CONN SOCKET SIP 9POS GOLD |
3,604 |
|
Datasheet |
346 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
714-43-107-31-018000CONN SOCKET SIP 7POS GOLD |
1,149 |
|
Datasheet |
714 | Bulk | Active | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
19-0513-10HCONN SOCKET SIP 19POS GOLD |
1,932 |
|
Datasheet |
0513 | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
42-1518-10TCONN IC DIP SOCKET 42POS GOLD |
1,212 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
115-87-952-41-001101CONN IC DIP SOCKET 52POS GOLD |
3,266 |
|
- |
115 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-328-41-003101CONN IC DIP SOCKET 28POS GOLD |
3,693 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-87-088-13-001101CONN SOCKET PGA 88POS GOLD |
3,669 |
|
Datasheet |
510 | Bulk | Active | PGA | 88 (13 x 13) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
2-1571550-4CONN IC DIP SOCKET 16POS GOLD |
2,268 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-83-632-41-001101CONN IC DIP SOCKET 32POS GOLD |
3,331 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-640-41-005101CONN IC DIP SOCKET 40POS GOLD |
4,852 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-640-41-605101CONN IC DIP SOCKET 40POS GOLD |
1,270 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0107-T-30.100" SCREW MACHINE SOCKET ARRAY |
2,792 |
|
Datasheet |
HLS | Tube | Active | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
|
2-1437539-2CONN IC DIP SOCKET 14POS GOLD |
1,151 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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