IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
23-0518-11

23-0518-11

CONN SOCKET SIP 23POS GOLD

Aries Electronics

1,620
RFQ
23-0518-11

Datasheet

518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
34-0518-10

34-0518-10

CONN SOCKET SIP 34POS GOLD

Aries Electronics

3,112
RFQ
34-0518-10

Datasheet

518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
APA-308-T-N

APA-308-T-N

ADAPTER PLUG

Samtec Inc.

1,703
RFQ
APA-308-T-N

Datasheet

APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
HLS-0108-T-10

HLS-0108-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,178
RFQ
HLS-0108-T-10

Datasheet

HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
346-93-108-41-013000

346-93-108-41-013000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

4,782
RFQ
346-93-108-41-013000

Datasheet

346 Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-108-41-013000

346-43-108-41-013000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

4,375
RFQ
346-43-108-41-013000

Datasheet

346 Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-87-422-41-009101

116-87-422-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,530
RFQ
116-87-422-41-009101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-AG12D-LF

514-AG12D-LF

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors

2,528
RFQ
514-AG12D-LF

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
22-3513-10

22-3513-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,047
RFQ
22-3513-10

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-210-41-013101

116-83-210-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,652
RFQ
116-83-210-41-013101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-640-41-001151

110-83-640-41-001151

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

1,122
RFQ

-

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-328-41-006101

116-83-328-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,652
RFQ
116-83-328-41-006101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-0513-10

24-0513-10

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,894
RFQ
24-0513-10

Datasheet

0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0203-G-11

HLS-0203-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,517
RFQ
HLS-0203-G-11

Datasheet

HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
116-83-420-41-008101

116-83-420-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,904
RFQ
116-83-420-41-008101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 28-HZL/01-7-TT

AR 28-HZL/01-7-TT

SOCKET

Assmann WSW Components

4,967
RFQ

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
510-87-072-11-001101

510-87-072-11-001101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

3,126
RFQ
510-87-072-11-001101

Datasheet

510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-072-11-041101

510-87-072-11-041101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

3,730
RFQ
510-87-072-11-041101

Datasheet

510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-072-11-061101

510-87-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

4,270
RFQ
510-87-072-11-061101

Datasheet

510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PLCC-032-TM-N-TR

PLCC-032-TM-N-TR

CONN SOCKET PLCC 32POS TIN

Samtec Inc.

1,162
RFQ
PLCC-032-TM-N-TR

Datasheet

PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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