IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
06-2513-11H

06-2513-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

4,103
RFQ
06-2513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-0513-10H

14-0513-10H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

1,537
RFQ
14-0513-10H

Datasheet

0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0518-11H

11-0518-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,377
RFQ
11-0518-11H

Datasheet

518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
19-0518-11

19-0518-11

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2,272
RFQ
19-0518-11

Datasheet

518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0106-T-31

HLS-0106-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,230
RFQ
HLS-0106-T-31

Datasheet

HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
28-3518-10T

28-3518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,337
RFQ
28-3518-10T

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-610-41-004101

116-83-610-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,993
RFQ
116-83-610-41-004101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-316-41-009101

116-83-316-41-009101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

4,955
RFQ
116-83-316-41-009101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-328-41-018101

116-87-328-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,797
RFQ
116-87-328-41-018101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-87-424-41-001101

123-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,120
RFQ
123-87-424-41-001101

Datasheet

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
516-AG11D-ESL

516-AG11D-ESL

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

1,209
RFQ
516-AG11D-ESL

Datasheet

500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 5.00µin (0.127µm) Beryllium Copper Polyester -55°C ~ 125°C
ICO-308-SST-L

ICO-308-SST-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,686
RFQ
ICO-308-SST-L

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-308-ZWTT

ICA-308-ZWTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,803
RFQ
ICA-308-ZWTT

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
110-87-632-41-105161

110-87-632-41-105161

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,957
RFQ
110-87-632-41-105161

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-44-052-24-000000

540-44-052-24-000000

CONN SOCKET PLCC 52POS TIN

Mill-Max Manufacturing Corp.

3,377
RFQ
540-44-052-24-000000

Datasheet

540 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
C8118-04

C8118-04

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,014
RFQ
C8118-04

Datasheet

Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-0513-11

15-0513-11

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,940
RFQ
15-0513-11

Datasheet

0513 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-0518-00

14-0518-00

CONN SOCKET SIP 14POS GOLD

Aries Electronics

1,658
RFQ
14-0518-00

Datasheet

518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
714-43-105-31-018000

714-43-105-31-018000

CONN SOCKET SIP 5POS GOLD

Mill-Max Manufacturing Corp.

3,470
RFQ
714-43-105-31-018000

Datasheet

714 Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-87-210-41-013101

116-87-210-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,375
RFQ
116-87-210-41-013101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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