IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
AR 50-HZL/01-TT

AR 50-HZL/01-TT

SOCKET

Assmann WSW Components

1,890
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ICA-308-ZSST

ICA-308-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,768
RFQ
ICA-308-ZSST

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
124-83-312-41-002101

124-83-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

4,169
RFQ

-

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-0513-11

08-0513-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

4,542
RFQ
08-0513-11

Datasheet

0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-314-41-009101

116-83-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1,203
RFQ
116-83-314-41-009101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-420-41-001101

612-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,389
RFQ
612-83-420-41-001101

Datasheet

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
3-822516-1

3-822516-1

CONN SOCKET PLCC 44POS TIN

TE Connectivity AMP Connectors

4,335
RFQ
3-822516-1

Datasheet

- Tape & Reel (TR) Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
APH-0902-T-R

APH-0902-T-R

APH-0902-T-R

Samtec Inc.

2,510
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1902-T-R

APH-1902-T-R

APH-1902-T-R

Samtec Inc.

2,547
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1602-T-R

APH-1602-T-R

APH-1602-T-R

Samtec Inc.

4,204
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0202-T-R

APH-0202-T-R

APH-0202-T-R

Samtec Inc.

4,381
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0702-T-R

APH-0702-T-R

APH-0702-T-R

Samtec Inc.

4,293
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0402-T-R

APH-0402-T-R

APH-0402-T-R

Samtec Inc.

3,320
RFQ

-

* - Active - - - - - - - - - - - - - - -
2-382470-4

2-382470-4

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

2,725
RFQ
2-382470-4

Datasheet

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR48-HZL/01-TT

AR48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

2,662
RFQ
AR48-HZL/01-TT

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
917-83-210-41-053101

917-83-210-41-053101

CONN TRANSIST TO-5 10POS GOLD

Preci-Dip

4,137
RFQ
917-83-210-41-053101

Datasheet

917 Bulk Active Transistor, TO-5 10 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-3513-10T

20-3513-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,701
RFQ
20-3513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-87-624-41-105101

117-87-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,092
RFQ
117-87-624-41-105101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-88-068-24-008

540-88-068-24-008

CONN SOCKET PLCC 68POS TIN

Preci-Dip

1,359
RFQ
540-88-068-24-008

Datasheet

540 Bulk Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
08-2513-10H

08-2513-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,519
RFQ
08-2513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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