IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
07-0513-10H

07-0513-10H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

1,545
RFQ
07-0513-10H

Datasheet

0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
114-83-320-41-117101

114-83-320-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

1,963
RFQ
114-83-320-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
9-1437535-4

9-1437535-4

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

4,181
RFQ
9-1437535-4

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper - -55°C ~ 125°C
116-87-314-41-009101

116-87-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,017
RFQ
116-87-314-41-009101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-003101

116-87-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,540
RFQ
116-87-320-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-308-ZSTT

ICO-308-ZSTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,651
RFQ
ICO-308-ZSTT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-308-ZSTT

ICA-308-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,636
RFQ
ICA-308-ZSTT

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
300-014-000

300-014-000

CONN SOCKET SIP 14POS GOLD

3M

2,226
RFQ

-

300 - Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
13-0513-10

13-0513-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,222
RFQ
13-0513-10

Datasheet

0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-0518-10

16-0518-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics

4,434
RFQ
16-0518-10

Datasheet

518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
05-0517-90C

05-0517-90C

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,502
RFQ
05-0517-90C

Datasheet

0517 Bulk Active SIP 5 (1 x 5) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-210-41-001101

116-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,211
RFQ
116-83-210-41-001101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-001101

116-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

4,550
RFQ
116-83-310-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-052-24-000000

540-99-052-24-000000

CONN SOCKET PLCC 52POS TIN-LEAD

Mill-Max Manufacturing Corp.

4,118
RFQ
540-99-052-24-000000

Datasheet

540 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
299-83-306-11-001101

299-83-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,941
RFQ
299-83-306-11-001101

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP640-001B

DIP640-001B

DIP640-001B-DIP SOCKET 40 CTS

Amphenol ICC (FCI)

4,349
RFQ
DIP640-001B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
HLS-0103-G-31

HLS-0103-G-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,922
RFQ
HLS-0103-G-31

Datasheet

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
115-87-628-41-003101

115-87-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,566
RFQ
115-87-628-41-003101

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X19-160B

SIP050-1X19-160B

1X19-160B-SIP SOCKET 19 CTS

Amphenol ICC (FCI)

1,064
RFQ
SIP050-1X19-160B

Datasheet

SIP050-1x Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-87-310-41-004101

116-87-310-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,622
RFQ
116-87-310-41-004101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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