IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
115-87-312-41-001101

115-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

1,793
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-310-41-003101

115-87-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,942
RFQ
115-87-310-41-003101

Datasheet

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-304-41-002101

116-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

4,330
RFQ
116-83-304-41-002101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-308-41-018101

116-87-308-41-018101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,824
RFQ
116-87-308-41-018101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-306-41-007101

116-87-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,130
RFQ
116-87-306-41-007101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
04-0518-10T

04-0518-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

1,180
RFQ
04-0518-10T

Datasheet

518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0508-20

01-0508-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics

1,510
RFQ
01-0508-20

Datasheet

508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
01-0508-30

01-0508-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,009
RFQ
01-0508-30

Datasheet

508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
AW 127-30/Z-T

AW 127-30/Z-T

SOCKET 30 CONTACTS SINGLE ROW

Assmann WSW Components

1,518
RFQ
AW 127-30/Z-T

Datasheet

- - Active - - - - - - - - - - - - - - -
AJ 28-LC

AJ 28-LC

SOCKET

Assmann WSW Components

1,564
RFQ

-

- Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
116-87-304-41-011101

116-87-304-41-011101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2,264
RFQ
116-87-304-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PRT-07939

PRT-07939

DIP SOCKETS SOLDER TAIL - 14-PIN

SparkFun Electronics

1,628
RFQ

-

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - - - Through Hole Open Frame Solder - - - - - -
PRT-07938

PRT-07938

DIP SOCKETS SOLDER TAIL - 16-PIN

SparkFun Electronics

4,350
RFQ

-

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - - Through Hole Open Frame Solder - - - - - -
HLS-0103-TT-10

HLS-0103-TT-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,868
RFQ
HLS-0103-TT-10

Datasheet

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
110-87-314-41-605101

110-87-314-41-605101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1,288
RFQ
110-87-314-41-605101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR28-HZL-TT

AR28-HZL-TT

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

1,837
RFQ
AR28-HZL-TT

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS20-Z-R

A-CCS20-Z-R

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

4,320
RFQ
A-CCS20-Z-R

Datasheet

- Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
115-83-308-41-001101

115-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,093
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-304-41-008101

116-83-304-41-008101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

1,502
RFQ
116-83-304-41-008101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0518-10H

05-0518-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

1,232
RFQ
05-0518-10H

Datasheet

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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