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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
02-0513-10TCONN SOCKET SIP 2POS GOLD |
1,905 |
|
Datasheet |
0513 | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
DIP314-011BDIP SOCKET 14 CTS |
4,895 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
A20-LCGCONN IC DIP SOCKET 20POS GOLD |
1,760 |
|
- |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
|
|
110-83-304-41-105101CONN IC DIP SOCKET 4POS GOLD |
1,117 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-87-304-41-007101CONN IC DIP SOCKET 4POS GOLD |
3,303 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
AW 127-19/Z-TSOCKET 19 CONTACTS SINGLE ROW |
4,166 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1571994-2CONN SOCKET SIP 2POS GOLD |
1,921 |
|
Datasheet |
510 | Bulk | Obsolete | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester | - |
|
612-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
4,106 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
SIP1X05-041BSIP1X05-041B-SIP SOCKET 5 CTS |
1,770 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
1-390263-5CONN IC DIP SOCKET 42POS TIN |
3,532 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C |
|
|
1-390262-6CONN IC DIP SOCKET 42POS TIN |
3,352 |
|
Datasheet |
- | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C |
|
|
614-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
1,162 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
AR 22-HZL/7-TTSOCKET |
2,754 |
|
- |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Brass | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
110-87-306-41-105101CONN IC DIP SOCKET 6POS GOLD |
1,283 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
A-CCS28-Z-SMCONN SOCKET PLCC 28POS TIN |
1,157 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
A18-LCGCONN IC DIP SOCKET 18POS GOLD |
4,934 |
|
- |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
|
|
AW 127-20/Z-TSOCKET 20 CONTACTS SINGLE ROW |
4,201 |
|
Datasheet |
- | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
612-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
1,201 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
A-CCS32-Z-SMCONN SOCKET PLCC 32POS TIN |
4,405 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
03-0518-10TCONN SOCKET SIP 3POS GOLD |
1,423 |
|
Datasheet |
518 | Bulk | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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