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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WMS-060ZCONN IC DIP SOCKET 6POS GOLD |
1,482 |
|
Datasheet |
WMS | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - | -40°C ~ 105°C |
|
XR2C-2000-HSGCONN IC SOCKET 20POS |
1,249 |
|
Datasheet |
XR2 | Bulk | Obsolete | Housing | 20 (1 x 20) | 0.100" (2.54mm) | - | - | Beryllium Copper | - | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
A22-LC-TRCONN IC DIP SOCKET 22POS TIN |
4,796 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
|
|
AR 10-HZL-TTCONN IC DIP SOCKET 10POS GOLD |
3,233 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AW 127-08/Z-TSOCKET 8 CONTACTS SINGLE ROW |
4,780 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SIP050-1X02-160B1X02-160B-SIP SOCKET 2 CTS |
1,201 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
|
ICO-486-S8A-TCONN IC DIP SOCKET 48POS TIN |
2,663 |
|
Datasheet |
ICO | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
|
|
ICO-486-S8-TCONN IC DIP SOCKET 48POS TIN |
4,716 |
|
Datasheet |
ICO | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
|
AR08-HZL-TTCONN IC DIP SOCKET 8POS TIN |
2,588 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
AW 127-04/Z-TSOCKET 4 CONTACTS SINGLE ROW |
1,795 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SIP1X05-011BSIP1X05-011B-SIP SOCKET 5 CTS |
4,211 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
115-87-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
2,671 |
|
- |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
AW 127-09/Z-TSOCKET 9 CONTACTS SINGLE ROW |
3,721 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
DIP308-014BDIP SOCKET 8 CTS |
1,593 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
114-87-304-41-117101CONN IC DIP SOCKET 4POS GOLD |
3,802 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
ICO-426-S8A-TCONN IC DIP SOCKET 42POS TIN |
1,233 |
|
Datasheet |
ICO | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
|
|
ICO-426-S8-TCONN IC DIP SOCKET 42POS TIN |
1,760 |
|
Datasheet |
ICO | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
|
|
AR 06 HGL-TTSOCKET |
4,100 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
DIP308-011BDIP SOCKET 8 CTS |
2,219 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
|
SIP1X06-014BSIP1X06-014B-SIP SOCKET 6 CTS |
1,798 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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